Copper-Diamond Heat Spreader Interface Roughness for Thermal Conduction
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Solution Overview
Problem
Existing copper-diamond composite heat dissipation members have room for improvement in thermal conductivity due to surface smoothness issues at the interface with metal films.
Innovation Solution
Control the ten-point average height Rz at the joint interface between the copper-diamond composite and the metal film to be within a specific range (5 μm to 100 μm) to enhance thermal conductivity, while maintaining adhesiveness, by adjusting the surface smoothness of the composite using grinding techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the surface of copper-diamond composite is polished to be flat, then the surface smoothness is improved, but the manufacturing complexity increases and thermal conductivity may deteriorate due to excessive material removal
Solution Approach 1:
The invention changes the surface roughness parameter to a specific range (Rz: 5-100 μm) that optimizes both thermal conductivity and adhesiveness. This parameter optimization resolves the contradiction by identifying that extreme smoothness (over-polishing) is not necessary and may be harmful, while some controlled roughness improves both thermal performance and bonding.
Solution Approach 2:
The invention applies partial polishing action rather than excessive polishing. By controlling the surface roughness to remain within a specific range rather than making it perfectly smooth, the invention avoids the harmful effects of excessive material removal while still achieving adequate surface quality for both thermal conductivity and adhesiveness.
2Strength
If the surface of copper-diamond composite is made very smooth, then the adhesiveness with metal film is improved, but the thermal conductivity deteriorates due to increased metal film thickness requirement
Solution Approach 1:
The invention optimizes the surface roughness parameter (Rz: 5-100 μm) to achieve a balance between adhesiveness and thermal conductivity. This specific parameter range allows adequate metal film formation for bonding while minimizing the thickness penalty that would harm thermal performance.
Solution Approach 2:
The invention uses the metal film itself as an intermediary layer that bridges the composite surface and the bonding interface. By controlling the surface roughness appropriately, the metal film can adequately conform to the surface topology for bonding while maintaining sufficient thermal pathways through the film.
3Manufacturing precision
If excessive polishing is applied to the copper-diamond composite surface, then the surface flatness is improved, but the diamond particles may be damaged and thermal conductivity decreases
Solution Approach 1:
The invention applies partial polishing action within controlled parameters rather than excessive polishing. By limiting the polishing degree to achieve Rz: 5-100 μm, the invention removes enough surface irregularities for adequate flatness while stopping before the threshold where diamond particle damage occurs and thermal conductivity deteriorates.
Solution Approach 2:
The invention establishes specific parameter boundaries (Rz: 5-100 μm) that define the optimal polishing endpoint. This parameter control prevents over-polishing by identifying the range where surface quality is sufficient without causing diamond particle damage that would harm thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal conductivity of the heat dissipation member is improved to 600 W/m·K or higher, with optimal surface smoothness and adhesiveness, resulting in enhanced heat dissipation characteristics.
Implementation Method 1
a copper-diamond composite where a plurality of diamond particles are dispersed in a metal matrix containing copper
Data Source
AI summary
A heat dissipation member according to the present invention includes: a copper-diamond composite where a plurality of diamond particles are dispersed in a metal matrix containing copper; and a metal film that is joined to at least one face of the copper-diamond composite, in which at a joint interface between the copper-diamond composite and the metal film, a ten-point average height Rz calculated according to JIS B 0601:2013 is 5 μm or more and 100 μm or less.