Copper-Diamond VC Wick Structure for High-Power Heat Dissipation
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Solution Overview
Problem
The existing heat sinks for high-power electronic devices face challenges in efficiently dissipating heat due to the low thermal conductivity of copper-based capillary wicks, which limits their ability to handle increasing power densities.
Innovation Solution
A composite VC heat sink is developed with a copper/diamond composite wick structure, featuring a three-dimensional porous structure, a diamond layer, and a metal hydrophilic layer, which enhances thermal conductivity and hydrophilicity, thereby improving heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper-based capillary wicks are used in VC heat sink, then the heat sink can efficiently transfer heat through gas-liquid phase changes, but the low thermal conductivity of copper limits the heat dissipation performance for high-power electronic devices
Solution Approach 1:
The patent applies composite materials by combining copper and diamond to create a copper/diamond composite wick structure. Diamond particles are incorporated into the copper matrix, leveraging diamond's superior thermal conductivity (5-10 times higher than copper) while maintaining copper's ductility and capillary properties. This composite structure resolves the thermal conductivity limitation of pure copper, enabling effective heat dissipation for high-power electronic devices.
Solution Approach 2:
The patent changes the material composition parameter by increasing diamond content in the composite wick structure. By controlling diamond particle size, distribution, and concentration within the copper matrix, the thermal conductivity parameter is enhanced while maintaining the necessary capillary pore structure for phase change heat transfer.
2Temperature
If diamond is composited with copper wick by coating diamond film, then thermal conductivity is improved, but the diamond content remains low and thermal conductivity improvement is limited
Solution Approach 1:
The patent utilizes porous materials by maintaining a three-dimensional porous structure in the copper/diamond composite wick. The porous architecture provides capillary channels for working fluid circulation while embedding high concentrations of diamond particles throughout the copper matrix. This approach achieves both high diamond content for thermal conductivity enhancement and adequate porosity for capillary action, overcoming the limitations of dense coated structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper/diamond composite wick structure significantly reduces thermal resistance, enhances heat transfer performance, and improves the suitability of the heat sink for new-generation high-power electronic devices.
Implementation Method 1
As a heat sink device that efficiently transfers heat from the hot side to the cold side by utilizing gas-liquid phase changes
Implementation Method 2
diamond has both high thermal conductivity and low thermal expansion, and it has unique advantages as a thermal conductivity enhancement material
Implementation Method 3
The copper/diamond composite wick structure has a three-dimensional porous structure and uses a copper/diamond sintered body as a matrix
Implementation Method 4
a surface of the diamond layer is provided with a metal hydrophilic layer
Implementation Method 5
a surface of the diamond layer is provided with a metal hydrophilic layer
Data Source
AI summary
A composite VC heat sink containing a copper/diamond composite wick structure and a method for preparing the same are provided. The VC heat sink includes a lower shell plate. The lower shell plate is provided with a recess at a center position of an inner surface and provided with a boss with a same plane size as the recess at a center position of an outer surface, and a surface of the boss or a surface of the recess is provided with a copper/diamond composite plate. The copper/diamond composite wick structure has a three-dimensional porous structure and uses a copper/diamond sintered body as a matrix, a surface of the matrix is provided with a diamond layer, and a surface of the diamond layer is provided with a metal hydrophilic layer. The heat dissipation performance of the composite VC heat sink is maximized under the cooperation of structure and materials.