Copper Die Pad Plating for Semiconductor Thermal Management
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Solution Overview
Problem
Semiconductor devices face reliability issues due to thermal resistance increases in heat dissipation paths and peeling of the sealing portion, which can lead to reduced efficiency and performance.
Innovation Solution
A semiconductor device design featuring a copper-based die pad and leads with a silver, gold, or platinum plating layer on the die pad, where the plating layer is covered by a conductive bonding material to prevent contact with the sealing resin, enhancing thermal conductivity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a copper-based die pad is used for mounting the semiconductor chip, then thermal conductivity is improved, but the die pad surface undergoes oxidation which increases thermal resistance
Solution Approach 1:
The die pad employs a composite structure combining copper (high thermal conductivity) with a plating layer (oxidation resistance). This composite material approach allows the copper base to provide excellent heat dissipation while the plating layer protects against oxidation, thereby maintaining low thermal resistance and improving both thermal conductivity and reliability simultaneously.
2Ease of manufacture
If the plating layer is exposed to contact with the sealing resin, then manufacturing is simplified, but peeling of the sealing portion occurs reducing reliability
Solution Approach 1:
The plating layer serves as an intermediary barrier between the copper die pad and the sealing resin. By positioning this oxidation-resistant plating layer to contact the sealing resin instead of the copper surface, it prevents direct interaction that would cause peeling, thereby improving reliability while the structure remains manufacturable through standard plating and sealing processes.
3Strength
If an oxidation-resistant plating layer is formed on the die pad, then adhesion to sealing resin is improved, but the plating layer requires protection from contact with sealing body
Solution Approach 1:
The plating layer is applied selectively to specific regions of the die pad surface where contact with the sealing resin occurs. This localized plating approach provides oxidation resistance and improved adhesion exactly where needed, while avoiding unnecessary complexity in regions where the plating is not required, thus balancing adhesion improvement with manageable device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency and prevents peeling of the sealing resin, thereby enhancing the reliability and performance of the semiconductor device.
Implementation Method 1
A plating layer formed by a silver plating layer, a gold plating layer, or a platinum plating layer is formed on a main surface of the chip mounting portion... improves heat dissipation efficiency
Implementation Method 2
The plating layer is covered by the first bonding material not to be in contact with the sealing body... prevents peeling of the sealing resin
Implementation Method 3
The plating layer is covered by the first bonding material not to be in contact with the sealing body... prevents peeling of the sealing resin
Data Source
AI summary
In order to improve reliability of a semiconductor device, the semiconductor device includes a semiconductor chip, a die pad, a plurality of leads, and a sealing portion. The die pad and the leads are made of a metal material mainly containing copper. A plating layer is formed on a top surface of the die pad. The plating layer is formed by a silver plating layer, a gold plating layer, or a platinum plating layer. The semiconductor chip is mounted on the plating layer on the top surface of the die pad via a bonding material. The plating layer is covered by the bonding material not to be in contact with the sealing portion.