Copper Electrode Oxide Layer for Ceramic Component Reliability
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Solution Overview
Problem
Ceramic electronic components face reliability issues under hot and humid conditions due to ion migration and short circuits caused by electrochemical migration of copper ions, particularly when the distance between external electrodes is close, leading to decreased insulation resistance and potential short circuits.
Innovation Solution
The use of protective copper oxide layers, specifically CuO and Cu2O, covering the edge portions of external electrodes to prevent ion migration and short circuits, with these layers being formed by oxidation processes such as heating in an oxygen-containing atmosphere, ensuring the entire surface coverage and effective prevention of electrochemical migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the distance between external electrodes is reduced to meet miniaturization demands, then the size of electronic devices can be reduced, but ion migration and electrochemical migration occur more easily causing short circuits
Solution Approach 1:
A protective layer made of copper oxide particles is applied between the copper external electrodes to act as a barrier against ion migration. This intermediary layer prevents direct electrochemical interaction between adjacent electrodes while maintaining electrical functionality, thus enabling smaller electrode spacing without compromising reliability.
Solution Approach 2:
The protective copper oxide layer is selectively applied to specific regions where ion migration is most likely to occur, such as the gaps between adjacent external electrodes. This localized protection allows miniaturization in non-critical areas while maintaining reliability where electrochemical migration risk is highest.
2Ease of manufacture
If Cu-plated external electrodes are used to ensure laser resistance, then laser beam processing can be performed, but weather resistance and reliability under hot and humid conditions deteriorate
Solution Approach 1:
The external electrode structure uses a composite configuration: a copper base layer for laser resistance and electrical conductivity, topped with a copper oxide protective layer for weather resistance. This composite structure combines the advantages of both materials, enabling both laser processing capability and improved reliability under hot and humid conditions.
Solution Approach 2:
The copper oxide layer serves as a protective intermediary between the copper electrode and the harsh environment (moisture, heat). It allows the copper to maintain its laser resistance properties while protecting it from electrochemical degradation, thus resolving the contradiction between manufacturability and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective copper oxide layers significantly improve the reliability of ceramic electronic components by preventing ion migration and maintaining insulation resistance, even under hot and humid conditions, and are particularly effective when the distance between electrodes is 0.6 mm or less.
Implementation Method 1
oxidizing a surface of the copper-metal-containing layer to form a protective copper oxide layer
Implementation Method 2
the surface of the copper-metal-containing layer is oxidized by heating the external electrode in an oxygen-containing atmosphere
Data Source
AI summary
A method for producing an electronic component including a body and first and second external electrodes arranged on an external surface of the body. An edge portion of the first external electrode and an edge portion of the second external electrode face each other on the body. The first and second external electrodes each include a copper-metal-containing layer and a protective copper oxide layer covering the copper-metal-containing layer within the edge portion of the first and second external electrodes, respectively.