Copper Electroplating Bath Pyrazole Bisepoxide Uniform Morphology
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Solution Overview
Problem
Current copper electroplating methods for photoresist defined features, such as copper pillars and redistribution layer wiring, often result in non-uniform surface morphology, which compromises the performance and reliability of advanced packaging articles.
Innovation Solution
A copper electroplating method using a bath comprising reaction products of pyrazole compounds and bisepoxides, along with an electrolyte, accelerators, and suppressors, to achieve copper photoresist features with a substantially uniform surface morphology, characterized by an average % TIR of 0% to 10% and % WID of 0% to 10%, ensuring smooth and nodule-free profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional copper electroplating methods are used for photoresist defined features, then high deposition rates can be achieved, but the surface morphology becomes non-uniform with nodules and irregularities
Solution Approach 1:
The patent applies parameter changes by modifying the chemical composition of the electroplating bath, specifically incorporating reaction products of pyrazole compounds and bisepoxides along with specific accelerators and suppressors. This chemical parameter modification enables the bath to produce uniform surface morphology while maintaining high deposition rates, resolving the contradiction between productivity and manufacturing precision.
Solution Approach 2:
The electroplating bath employs a composite chemical system combining multiple components: pyrazole compounds, bisepoxides, accelerators, and suppressors. This composite formulation works synergistically to control copper deposition, achieving both high deposition rates and uniform surface morphology that cannot be obtained with single-component additives.
2Productivity
If electroplating is used to form copper pillars, then mass productivity is achieved without polishing or corrosion processes, but the surface morphology uniformity is compromised
Solution Approach 1:
The patent applies preliminary action by incorporating specific chemical additives (pyrazole-bisepoxide reaction products, accelerators, and suppressors) into the electroplating bath before the plating process. These pre-configured chemicals work during deposition to ensure uniform surface morphology is achieved during the high-speed mass production process, eliminating the need for subsequent polishing or corrosion processes.
3Productivity
If high deposition rates are pursued in copper electroplating, then wafer throughput is improved, but surface irregularities and nodules form on the plated features
Solution Approach 1:
The electroplating bath incorporates accelerators and suppressors that provide feedback control during the deposition process. These additives respond to local deposition conditions, modulating the plating rate dynamically to maintain uniform surface morphology even at high overall deposition rates, thus enabling improved wafer throughput without surface irregularities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides copper photoresist features with a uniform morphology, ensuring flat profiles for copper pillars and bond pads, enhancing the reliability and performance of advanced packaging technologies by maintaining high deposition rates and avoiding surface irregularities.
Implementation Method 1
The substrate with the patterned photoresist is then immersed in a metal electroplating bath, typically a copper electroplating bath, and metal is electroplated in the circuit line pattern or aperture to form features such as pillars, bond pads or circuit lines
Implementation Method 2
electroplating a plurality of copper photoresist defined features in the plurality of apertures
Data Source
AI summary
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.