Copper Embedding Layer for Aluminum-Copper Heat Sink Welding
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Solution Overview
Problem
The challenge is to develop a heat sink structure with reduced overall weight and improved welding efficiency between aluminum and copper materials without using toxic electroless nickel plating, which is environmentally harmful and faces difficulties due to differences in melting points and eutectic formation during welding.
Innovation Solution
A copper embedding layer is applied to the aluminum fin assembly, allowing direct welding with copper heat pipes or bases without electroless nickel plating, reducing thermal resistance and enhancing heat transfer efficiency by forming strong bonds through welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If aluminum material is used for fins and heat sink base, then weight is reduced and cost is lowered, but welding difficulty increases due to oxide formation and eutectic issues
Solution Approach 1:
A copper embedding layer is introduced as an intermediary between the aluminum fin assembly and copper heat pipes. This copper layer serves as a mediator that enables reliable welding connections, as copper can be directly welded to copper without the oxide formation and eutectic problems that occur when welding aluminum to copper. The copper embedding layer is formed by providing copper material in grooves or holes of the aluminum fin assembly and bonding it to the aluminum base.
2Ease of manufacture
If electroless nickel plating is applied to aluminum surface, then welding compatibility with copper is improved, but environmental pollution increases due to toxic substances
Solution Approach 1:
The invention extracts and eliminates the electroless nickel plating process from the manufacturing workflow. Instead of applying a nickel coating to the aluminum surface to enable welding, the patent uses a copper embedding layer that allows direct copper-to-copper welding, thereby removing the source of toxic substances and environmental pollution associated with electroless nickel plating.
3Reliability
If copper heat pipes are directly welded to aluminum fins, then heat transfer efficiency is improved, but welding reliability deteriorates due to melting point differences and eutectic formation
Solution Approach 1:
The copper embedding layer acts as an intermediary that connects the aluminum fin assembly to the copper heat pipes. This allows the heat pipes to be welded to the copper layer (ensuring reliable welding and efficient heat transfer), while the copper layer itself is bonded to the aluminum base, thus bridging the two dissimilar metals without direct welding between them.
4Ease of manufacture
If electroless nickel plating process is used, then welding process is enabled, but manufacturing complexity and time increase
Solution Approach 1:
The invention removes the multi-step electroless nickel plating process from the manufacturing sequence. The copper embedding layer can be formed more simply by placing copper material in prepared grooves or holes of the aluminum fin assembly and bonding it, eliminating the need for chemical plating baths, activation steps, and extensive process control required for electroless nickel plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables direct welding of aluminum and copper components without toxic substances, reducing structural weight and thermal resistance, while ensuring environmental protection and improving heat transfer efficiency.
Implementation Method 1
A copper embedding layer is applied to the aluminum fin assembly, allowing direct welding with copper heat pipes or bases without electroless nickel plating, reducing thermal resistance and enhancing heat transfer efficiency
Implementation Method 2
allowing direct welding with copper heat pipes or bases without electroless nickel plating
Data Source
AI summary
A heat sink structure with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one through hole and al least one groove, in which a copper embedding layer is provided for contacting with and connected to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.