Copper Film-Forming Agent for Low-Temperature Adhesion
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Solution Overview
Problem
Existing methods for forming copper films face challenges such as high manufacturing costs, environmental impact, and insufficient electrical conductivity due to the need for nano-sized copper particles and excessive resin binders, as well as adhesion issues on hydrophobic surfaces, particularly when depositing copper at temperatures above 130°C.
Innovation Solution
A copper film-forming agent composed of a copper formate complex with a 5- or 6-membered nitrogen-containing heterocyclic compound, such as imidazole, triazole, or pyridine, is used, allowing for copper film formation at atmospheric pressure and temperatures of 130°C or lower, ensuring excellent adhesion to hydrophilic surfaces by stabilizing the copper formate complex and facilitating uniform deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper particles are processed into nano-level size to reduce resin binder remaining in conductor, then electrical conductivity is improved, but manufacturing costs become high
Solution Approach 1:
The patent changes the particle size parameter from nano-level to micro-level (1-100 μm), and changes the chemical form from metallic copper particles to copper formate complex, achieving good electrical conductivity without requiring nano-scale processing, thus reducing manufacturing costs
Solution Approach 2:
The patent uses readily available copper formate complex and conventional-sized particles instead of expensive nano-scale copper particles, achieving cost-effective copper film formation with sufficient electrical conductivity
2Reliability
If copper is deposited at higher temperature to improve deposition quality, then adhesion to base material is improved, but heat load to base material and energy consumption increase
Solution Approach 1:
The patent changes the deposition temperature parameter from conventional high temperature to low temperature (130°C or lower), achieving good adhesion through the chemical properties of the copper formate complex and nitrogen-containing heterocyclic compound rather than thermal energy
Solution Approach 2:
The patent replaces thermal-mechanical adhesion (relying on heat and pressure) with chemical adhesion (relying on molecular interactions between copper formate complex, nitrogen-containing heterocyclic compound, and base material surface)
3Use of energy by stationary object
If copper is deposited at temperature of 130°C or lower to reduce heat load, then energy consumption is reduced, but adhesion to hydrophobic surface becomes insufficient
Solution Approach 1:
The patent changes the chemical composition parameters by introducing copper formate complex and nitrogen-containing heterocyclic compound, which provide inherent adhesion capability at low temperatures through chemical bonding rather than thermal bonding
Solution Approach 2:
The nitrogen-containing heterocyclic compound acts as an intermediary that facilitates adhesion between copper and the base material surface at low temperatures, forming a chemical bridge that ensures good adhesion without requiring high heat input
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of high-uniformity copper films with improved electrical conductivity and reduced resin binder residue, suitable for materials with low heat resistance, like polyethylene terephthalate, while ensuring strong adhesion to hydrophilic surfaces and reducing energy consumption.
Implementation Method 1
a method for forming a copper film, containing: a coating step of coating the copper film-forming agent on a base material to form a coating film; and a heating step of heating and burning the coating film
Data Source
AI summary
The present invention is a copper film-forming agent containing a copper complex composed of a copper formate and a 5-membered or 6-membered nitrogen-containing heterocyclic compound having from 1 to 3 nitrogen atoms, in which the nitrogen-containing heterocyclic compound has one or two ring structures, the total number of carbon atoms contained in a substituent is from 1 to 5, and an element other than a carbon atom in the compound is not bonded to a hydrogen atom.