Copper Film Interface Layer for LCD Panel Adhesion
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Solution Overview
Problem
The challenge in increasing the size of liquid crystal display (LCD) panels is the high impedance of conventional materials like aluminum, which leads to issues with copper alternatives, such as weak adhesive force and diffusion into substrates, causing quality problems and increased costs.
Innovation Solution
A structure and manufacture method for LCD panels using a copper film with a first interface layer, composed of copper oxygen or nitrogen solid solutions, which enhances adhesive force and reduces diffusion, allowing for a single etching process and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper is used as alternative material to reduce impedance, then impedance value is reduced, but adhesive force between copper and substrate becomes weak causing peeling
Solution Approach 1:
An interface layer comprising copper oxide or copper nitride is introduced between the copper film and substrate. This interface layer acts as an intermediary that chemically bonds to both the copper film and the substrate, providing strong adhesion while allowing the copper film to maintain its low impedance properties. The interface layer resolves the adhesion problem without compromising the electrical performance of the copper interconnect.
2Reliability
If copper film is deposited onto substrate, then impedance is reduced, but copper diffuses into substrate causing quality problems
Solution Approach 1:
The interface layer of copper oxide or copper nitride serves as a diffusion barrier between the copper film and the substrate. This intermediate layer prevents copper atoms from diffusing into the substrate during subsequent processing steps, while still allowing the copper film to function effectively for electrical conduction. The interface layer thus eliminates the harmful diffusion effect while preserving the beneficial low impedance characteristic.
3Strength
If isolated layer is formed between substrate and copper film to improve adhesion, then adhesive force is enhanced, but manufacture process becomes complicated
Solution Approach 1:
The interface layer is formed by oxidizing or nitridizing the copper film in-situ during the deposition process, rather than adding a separate isolated layer. This merging of the interface layer formation with the copper film deposition process simplifies the manufacturing steps while still providing the necessary adhesion enhancement. The interface layer is created as an integral part of the copper interconnect structure, eliminating the need for additional process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the adhesive force between the copper film and substrate, prevents peeling, and simplifies the manufacturing process by using a single etching step, while maintaining low impedance values.
Implementation Method 1
the first interface layer is disposed to enhance the adhesive force between the copper film and the substrate
Implementation Method 2
When the deposition is in processing, the isolated layer 20 efficiently reduces the diffusion speed of the copper elements
Data Source
AI summary
A display panel structure having a circuit element disposed thereon and method of manufacture are provided. The display panel includes a substrate and the circuit element disposed on the substrate. The circuit element has a first interface layer and a first conductive layer. Both the first interface layer and the first conductive layer have cooper materials. The material which makes the first interface layer includes a reactant or a compound of the material which makes the first conductive layer. The method for manufacturing includes the following steps: forming a first interface layer on the substrate; forming a first conductive layer on the first interface layer; and etching the first conductive and interface layers to form a pattern. The existence of the first interface reduces the penetration of the first conductive layer on the substrate and improves the adhesive force between the first conductive layer and the substrate.