Thermally Superconducting Radiator Using Copper Fins
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Solution Overview
Problem
Current radiators for high-power electronic devices, including air-cooled and liquid-cooled systems, face inefficiencies in heat dissipation due to low thermal conductivity and complexity, leading to performance degradation and safety risks.
Innovation Solution
A thermally superconducting radiator featuring alternately arranged separators and heat dissipation fins with interconnected closed pipes filled with a heat transfer medium, enhancing heat transfer efficiency and reducing size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aluminum or aluminum alloy is used for heat dissipation fins, then the radiator structure is simple and cost-effective, but the thermal conductivity is less than 220 W/m·K resulting in low fin efficiency and poor thermal diffusivity
Solution Approach 1:
The patent employs copper as the base material for heat dissipation fins, leveraging its superior thermal conductivity (approximately 400 W/m·K, nearly double that of aluminum alloys). This material substitution directly resolves the thermal conductivity limitation while maintaining structural simplicity, achieving high fin efficiency without requiring complex radiator designs
2Reliability
If liquid-cooled heat radiation system is used, then the heat dissipation capability is improved, but the system becomes complex, bulky, expensive with multiple connection heads causing liquid leakage and safety risks
Solution Approach 1:
The patent extracts and eliminates the liquid cooling system entirely, including pumps, reservoirs, heat exchangers, connecting pipes, and valves. By removing these complex components and their associated risks (corrosion, fouling, antifreezing problems, liquid leakage), the invention achieves superior heat dissipation capability through a simplified air-cooled radiant fin structure
Solution Approach 2:
The patent replaces the mechanical liquid cooling system with a passive air-cooled thermal radiation system. The copper radiant fins naturally dissipate heat through thermal radiation and convection without requiring mechanical pumps or fluid circulation, eliminating the complexity and safety risks of the liquid cooling system while maintaining effective heat dissipation
3Productivity
If conventional air-cooled radiators are used, then the structure is simple, but the fin efficiency is low and cannot meet the heat dissipation requirement of high heat flux density high-power modules
Solution Approach 1:
The patent uses pure copper material for the radiant fins, which has thermal conductivity nearly double that of aluminum alloys. This material choice fundamentally improves both the heat dissipation efficiency and thermal diffusivity, enabling the radiator to meet the demanding heat dissipation requirements of high heat flux density high-power modules while maintaining structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The radiator achieves a 90% fin efficiency and improved cooling capability, suitable for high-power high heat flux density applications, replacing conventional radiators with a more efficient, cost-effective, and safer solution.
Implementation Method 1
The closed pipes are filled with a heat transfer working medium. The separators and the thermally superconducting heat dissipation fins are alternately arranged, and one end face of the separator is flush with one end face of the thermally superconducting heat dissipation fin, together forming a mounting surface suitable for mounting a power device.
Implementation Method 2
a thermally superconducting radiator and a method for manufacturing the same for solving the problem that a heat dissipation fin of air-cooled radiators existing in the prior art is inefficient and cannot satisfy the heat dissipation requirement
Data Source
AI summary
A thermally superconducting radiator and a method for manufacturing the same. The thermally superconducting radiator comprises a plurality of separators and a plurality of thermally superconducting heat dissipation fins. The separators and the thermally superconducting heat dissipation fins are alternately arranged, and one end face of the separator is flush with one end face of the thermally superconducting heat dissipation fin, together forming a mounting surface suitable for mounting a power device. The thermally superconducting heat dissipation fins and the separators are fixedly connected. Replacing the conventional heat dissipation fins in the prior art with the thermally superconducting heat dissipation fins enables the thermally superconducting radiator to have a greater heat transfer rate and a more efficient fin efficiency. The fin efficiency of the heat dissipation fin is not affected by the height, which greatly improves the cooling capability of the radiator.