Ultrathin Copper Foil Carrier Release Layer Design
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Solution Overview
Problem
The existing ultrathin copper foils with carriers face issues such as blistering, instability at high temperatures, and environmental concerns due to the use of chromium (Cr) in the release layer, which affects the bond strength and safety, particularly in high-temperature applications and fine pattern printed circuit boards.
Innovation Solution
A ultrathin copper foil with a carrier is developed, featuring a carrier foil, a diffusion prevention layer, and release layers composed of metals A and B with specific composition ratios, where metal A retains the release property and metal B facilitates plating, ensuring easy peeling and stability even at high temperatures, while minimizing Cr content to address environmental concerns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If chromium (Cr) is used in the release layer to enable easy peeling, then carrier peeling properties are improved, but blistering occurs at high temperatures and environmental safety deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the release layer by replacing chromium with alternative metals (such as nickel, zinc, or their alloys) that maintain release properties without causing blistering at high temperatures. This parameter substitution resolves the contradiction between easy peeling and high-temperature stability.
Solution Approach 2:
The patent employs composite material structures in the release layer, combining multiple metals or metal alloys that collectively provide both the necessary release properties for easy peeling and the thermal stability required to prevent blistering at high temperatures during PCB manufacturing processes.
2Ease of operation
If chromium (Cr) is used in the release layer to retain release properties, then carrier peeling is facilitated, but environmental safety and production stability worsen
Solution Approach 1:
The patent extracts and removes chromium from the release layer composition, eliminating the harmful environmental factor while maintaining the essential release properties through alternative metal materials that do not pose environmental risks.
Solution Approach 2:
The patent changes the material composition parameter by substituting chromium with environmentally friendly metals, thereby removing the harmful factor while preserving the functional release properties needed for carrier peeling operations.
3Manufacturing precision
If ultrathin copper foil is used to achieve fine pattern requirements, then manufacturing precision is improved, but mechanical strength decreases causing wrinkles and breaks
Solution Approach 1:
The patent utilizes the thin film structure of ultrathin copper foil (5μm or less) to achieve the required fine pattern manufacturing precision, while the flexible nature of the thin foil is managed through proper carrier selection and handling procedures to prevent mechanical failure.
Solution Approach 2:
The patent creates a composite structure by bonding the ultrathin copper foil to a carrier material, combining the fine pattern capability of the thin copper layer with the mechanical strength of the carrier, thereby resolving the contradiction between precision and strength.
4Strength
If thick copper foil is used to maintain mechanical strength, then strength is improved, but etching time increases and verticalness is lost
Solution Approach 1:
The patent changes the thickness parameter of the copper foil to 5μm or less, which reduces etching time and maintains sidewall verticalness for fine patterns, while the mechanical strength requirement is compensated through the carrier material and optimized processing parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable, environmentally friendly ultrathin copper foil with improved carrier peeling properties and reduced blistering, suitable for high-density fine pattern applications, ensuring reliable production and safety in high-temperature conditions.
Implementation Method 1
a diffusion prevention layer
Implementation Method 2
release layers composed of metals A and B for facilitating plating of the ultrathin copper foil
Implementation Method 3
a surface on the side heat pressed to a plastic substrate or the like is formed as a roughened surface and this roughened surface is used to manifest an anchor effect with respect to the substrate so as to raise a bond strength
Implementation Method 4
ultrathin copper foil deposited by electric copper plating
Data Source
AI summary
An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≤a/a+b*100≤70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.