Copper Foil Electrodeposition With Fe2+/Fe3+ Copper Dissolution
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Solution Overview
Problem
Conventional copper foil production processes consume large amounts of energy, active carbon, and require significant maintenance due to oxygen evolution at the anode, leading to organic compound degradation and complex equipment.
Innovation Solution
A continuous process using an Fe2+/Fe3+ redox system to maintain copper ion concentration, where copper metal is dissolved by oxidizing it with Fe3+ and oxygen-containing gas, eliminating the need for high temperatures and active carbon, and simplifying the equipment design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional copper dissolution process with heating to 80°C and air blowing is used, then copper metal dissolves into electrolyte, but organic compounds are destroyed and require active carbon removal
Solution Approach 1:
The invention changes the temperature parameter from conventional 80°C heating to ambient temperature operation, and introduces Fe3+ as a chemical oxidant instead of thermal oxidation. This parameter change prevents organic compound degradation while maintaining effective copper dissolution rates.
Solution Approach 2:
The invention introduces Fe3+ ions as an intermediary oxidizing agent that mediates the copper dissolution process. The Fe3+ oxidizes copper metal to Cu2+ without requiring high temperatures that would degrade organic compounds, thus acting as a benign mediator in the dissolution process.
2Loss of substance
If active carbon is used to remove destroyed organics, then organic compounds are removed from electrolyte, but significant amounts of active carbon are consumed and require disposal
Solution Approach 1:
The invention converts the harmful effect of organic compound degradation into a benefit by preventing the degradation in the first place through ambient temperature operation with Fe3+ oxidation. This eliminates the need for active carbon treatment entirely, transforming a harmful process into a benign one.
3Productivity
If oxygen is created at anode surface during plating, then copper is deposited on cathode, but oxygen bubbles cause plating defects and anode damage
Solution Approach 1:
The invention introduces Fe2+/Fe3+ redox couple as intermediaries that mediate the copper ion regeneration process. Instead of direct water oxidation at the anode producing oxygen bubbles, the Fe2+ is oxidized to Fe3+ which then dissolves copper metal externally, eliminating oxygen evolution at the anode surface while maintaining copper deposition productivity.
4Quantity of substance
If electrolyte is heated to 80°C for copper dissolution, then copper dissolves efficiently, but energy consumption increases significantly
Solution Approach 1:
The invention fundamentally changes the temperature parameter from 80°C thermal processing to ambient temperature chemical processing using Fe3+ oxidation. This parameter change maintains copper dissolution efficiency while eliminating the high energy consumption associated with heating large volumes of electrolyte.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces energy consumption, minimizes active carbon use, extends anode lifetime, and maintains copper ion concentration efficiently, thereby reducing operational costs and maintenance needs.
Implementation Method 1
copper metal continuously dissolves into the electrolyte solution by being oxidized by the Fe3+ component of the Fe2+/Fe3+ redox system
Implementation Method 2
the oxygen-containing gas is introduced such that bubbles thereof contact the surface of the copper metal
Implementation Method 3
copper is electrolytically deposited on a rotating drum cathode, which is partially immersed in an electrolyte solution
Data Source
AI summary
The invention relates to a process for producing copper foil by electrolytic deposition of copper metal on a rotating drum cathode and, in particular, to the means for dissolving the copper to be deposited in the process. In the process, copper is electrolytically deposited on a rotating drum cathode, which is partially immersed in an electrolyte solution contained in a plating tank; the deposited copper layer is peeled off the part of the drum cathode that is not immersed in the electrolyte solution to obtain the copper foil; an insoluble anode is used as counter-electrode to the drum cathode; the electrolyte solution contains copper ions, organic additives and an Fe2+/Fe3+ redox system; the concentration of copper ions in the electrolyte solution is maintained constant by passing the electrolyte solution through a copper dissolution unit; in the copper dissolution unit, the electrolyte solution is in contact with an auxiliary anode and an auxiliary cathode; copper metal and an oxygen-containing gas are introduced into the copper dissolution unit; the auxiliary anode is in contact with the copper metal; the oxygen-containing gas contacts the surface of the copper metal; the copper metal continuously dissolves into the electrolyte solution by being oxidized by the Fe3+ component of the Fe2+/Fe3+ redox system.