Surface Treated Copper Foil Particle Dropping Suppression
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Solution Overview
Problem
The existing methods for manufacturing printed wiring boards face issues with contamination from roughening particles on copper foils, leading to short circuits and wrinkles or stripes during bonding with insulating substrates, particularly when the roughening treatment layer is fine.
Innovation Solution
The surface-treated copper foil is designed with a roughening treatment layer where the aspect ratio of particles is controlled to 3 or less, and the glossiness of the treatment layer is maintained at 70% or less, preventing particle dropping and wrinkles during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the roughening treatment layer is made finer to achieve miniaturization of wiring, then the adhesion to insulating resin is improved, but the roughening particles drop off during contamination removal and cause conductive contamination leading to short circuits
Solution Approach 1:
The invention changes the physical parameters of the roughening particles by controlling their aspect ratio (height/thickness) to be 3 or less, and controlling the surface glossiness to be 70% or less. These parameter changes optimize the particles to remain attached during contamination removal while still providing adequate adhesion for insulating resin, thereby preventing conductive contamination and short circuits.
2Manufacturing precision
If the roughening treatment layer is made finer to achieve miniaturization of wiring, then the adhesion to insulating resin is improved, but wrinkles or stripes occur when bonding with insulating substrate
Solution Approach 1:
The invention changes the surface morphology parameters by controlling the aspect ratio of roughening particles to be 3 or less and the glossiness to be 70% or less. These parameter changes create a surface structure that provides adequate adhesion without causing excessive surface deformation during bonding, thereby preventing wrinkles and stripes on the laminate while achieving fine pitch conductor patterns.
3Reliability
If contamination removal is performed to prevent short circuits, then the conductive contamination is removed, but the roughening particles drop off and are transferred to copper foil or conveying device
Solution Approach 1:
The invention changes the physical properties of roughening particles by controlling their aspect ratio to be 3 or less and their surface glossiness to be 70% or less. These parameter changes enhance the particles' attachment strength to the copper foil surface, allowing contamination removal processes to effectively eliminate conductive contamination without causing the roughening particles to drop off and transfer to the copper foil or conveying device.
Data Source
AI summary
The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.The surface treated copper foil comprises a copper foil, anda roughening treatment layer on at least one surface of the copper foil,wherein an aspect ratio of roughening particles of the roughening treatment layer satisfies one or more of the following items (1) and (2), the aspect ratio being a height of the roughening particles/a thickness of the roughening particles:(1) the aspect ratio of the roughening particles is 3 or less,(2) the aspect ratio of the roughening particles satisfies any one of the following items (2-1) or (2-2):(2-1) the aspect ratio of the roughening particles is 10 or less in the case that the height of the roughening particles is more than 500 nm and 1000 nm or less,(2-2) the aspect ratio of the roughening particles is 15 or less in the case that the height of the roughening particles is 500 nm or less; anda glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.