Copper Foil Release Carrier Structure for Damage-Free Separation

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Solution Overview

Problem

The challenge in manufacturing thin or ultra-thin copper foils for micro or thin printed circuit boards is the strong bonding force between the copper foil and the carrier structure, which often leads to damage, wrinkles, or patterns when attempting to separate them, especially with methods like tearing or peeling.

Innovation Solution

A release carrier structure is developed with a first release layer of inorganic metal salt and a second release layer of organic material, where the weight ratio of organic matter in the second layer is higher, facilitating easy separation of the copper foil from the carrier structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a carrier structure with strong bonding force is used to support thin copper foil, then the copper foil can be properly supported during manufacturing, but it becomes difficult to separate the copper foil from the carrier structure without causing damage

Engineering Contradiction:

Improvebonding force between copper foil and carrier structureVSAvoidease of separation of copper foil from carrier structure

Core Design Contradiction:

StrengthVSEase of operation

Solution Approach 1:

The release layer is divided into two distinct layers: a first release layer with inorganic metal salt and a second release layer with organic material having higher weight ratio of organic matter. This segmentation allows each layer to perform different functions - the first layer provides initial bonding support while the second layer facilitates easy separation, resolving the contradiction between strong bonding and easy separation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the release layer are given different properties - the first release layer has inorganic metal salt composition for strong bonding, while the second release layer has organic material composition for easy separation. This local differentiation of material properties allows the structure to simultaneously achieve both strong bonding capability and easy separation capability in different zones.

Inventive Principle:

Principle #3Local quality

2Productivity

If a larger force is applied to tear or peel off the copper foil from the carrier structure, then the copper foil can be separated, but it causes damage, wrinkles, or patterns in the copper foil

Engineering Contradiction:

Improveseparation efficiency of copper foilVSAvoidquality of copper foil (absence of damage, wrinkles, patterns)

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The composition parameters of the release layer are changed by incorporating two different material compositions with distinct separation characteristics. The second release layer with higher organic matter content provides controlled separation properties that allow copper foil to be peeled off at lower forces, maintaining foil integrity while achieving efficient separation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The release layer is constructed as a composite structure combining inorganic metal salt material and organic material in two distinct layers. This composite structure leverages the complementary properties of both materials - the inorganic layer for bonding stability and the organic layer for controlled separation - enabling both high productivity and high manufacturing precision.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12492482B2Release carrier structure and copper foil composite structure

Publication Date: 2025.12.09 NANYA PLASTICS CORP

AI summary

A release carrier structure includes a carrier layer, a first release layer, and a second release layer. A weight ratio of organic matter in the second release layer is greater than a weight ratio of organic matter in the first release layer.