Copper Foil Thermal Path for Network Automation Heat Dissipation
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Solution Overview
Problem
Industrial automation systems face challenges in heat dissipation due to increasing temperatures of components like FPGA chips, CPUs, and chipsets, which can lead to system instability and reduced performance.
Innovation Solution
A thermal conducting structure is implemented, featuring copper foil layers on a circuit board that connect to a cooler bracket via a positioning structure with sliding edges and elastic convex parts, forming a thermal path to enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the system uses high-performance components (FPGA chip, CPU, chipset) to achieve high computing power and fast speed, then the processing performance is improved, but the temperature of these components increases significantly, leading to heat dissipation problems
Solution Approach 1:
The patent transitions from single-sided heat dissipation to dual-sided heat dissipation by utilizing copper foil layers on both the top and bottom surfaces of the circuit board. This dimensional expansion of the heat dissipation path allows heat to be conducted simultaneously through multiple surfaces, effectively increasing the heat dissipation area and reducing component temperatures while maintaining high processing performance
Solution Approach 2:
The patent introduces copper foil layers as intermediary thermal conduction elements between the heat-generating components and the heat dissipation structures. These copper foil layers serve as thermal mediators that efficiently transfer heat from the FPGA chip, CPU, and chipset through the circuit board to the positioning structure and cooler bracket, resolving the thermal management challenge without compromising processing performance
2Loss of energy
If copper foil layers are added to both sides of the circuit board to increase heat dissipation area, then heat dissipation efficiency is improved, but the structural complexity of the thermal conducting path increases
Solution Approach 1:
The positioning structure serves multiple functions: it provides mechanical positioning for the circuit board while simultaneously acting as a thermal conduction path through its integration with the copper foil layers and cooler bracket. This multi-functionality reduces the need for separate dedicated thermal management components, thereby improving heat dissipation efficiency without proportionally increasing structural complexity
Solution Approach 2:
The patent merges the thermal conduction function with the existing mechanical structures (positioning structure and cooler bracket) by integrating copper foil layers into these components. This consolidation creates a unified thermal management system where the cooling structure also serves as the mechanical support and positioning system, improving heat dissipation efficiency while minimizing additional structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively increases the heat dissipation area and improves overall heat dissipation efficiency, maintaining system stability and performance by conducting heat from the circuit module to the cooler bracket, while also protecting the components from physical damage and noise interference.
Implementation Method 1
copper foil layers are disposed on the bare copper regions and covered with sliding edges of track members located at two side panels of an outer shell member of the positioning structure to form a thermal conducting path
Implementation Method 2
each of the two side panels of the outer shell member defines at least one elastic convex part on a surface thereof. Through the opening of the cooler bracket, the circuit module in cooperation with the positioning structure can be inserted into a docking chamber
Data Source
AI summary
The present disclosure provides a thermal conducting structure applied to a network control automation system. A circuit board defines bare copper regions located at two opposite sides thereof, and copper foil layers are disposed on bare copper regions and cover sliding edges on two side panels to form a thermal conducting path. An accommodation open chamber is formed between outer shell member and two side panels thereof for positioning circuit board, the two side panels of outer shell member have elastic convex parts disposed on surfaces thereof. The circuit module cooperating with positioning structure can be inserted into docking chamber by slidably mounting sliding edge along mounting part from opening, and elastic convex parts are abutted with sidewall around mounting parts to form thermal conducting path, so that heat generated during operation can be conducted to cooler bracket thereby increasing entire heat dissipation area and further improving heat dissipation efficiency.