Surface-Treated Copper Foil for Fine Wiring Adhesion
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Solution Overview
Problem
Conventional methods for forming fine wirings on semiconductor package substrates and printed wiring boards face challenges in achieving both satisfactory adhesion of electroless copper plating and maintaining fine wiring formability, as the profile of the substrate surface needs to be both small and smooth for adhesion but large for formability.
Innovation Solution
A surface-treated copper foil with a controlled area ratio of surface particles and a resin substrate with quantified asperity form are used, where the copper foil is bonded to the substrate and then removed, maintaining fine wiring formability and achieving strong adhesion of electroless copper plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the profile of the substrate surface is made small and smooth, then the adhesion of electroless copper plating coating is improved, but fine wiring formability is impaired
Solution Approach 1:
The invention changes the surface profile parameters by controlling the area ratio of particles to be 0.05 to 0.70 and average particle diameter to be 0.03 to 0.28 μm. This optimized parameter range creates an intermediate surface condition that provides sufficient adhesion while preserving fine wiring formability, resolving the contradiction between smooth surface for adhesion and rough surface for wiring formation.
2Reliability
If the profile of the substrate surface is made large, then the adhesion of electroless copper plating coating is improved, but fine wiring formability is impaired
Solution Approach 1:
The invention establishes specific parameter ranges for particle area ratio (0.05 to 0.70) and average particle diameter (0.03 to 0.28 μm) that optimize the surface profile. These controlled parameters ensure adequate adhesion strength while preventing excessive roughness that would hinder fine wiring formation, thus resolving the contradiction.
3Reliability
If a surface-treated copper foil with controlled particle area ratio and average diameter is used, then both fine wiring formability and adhesion of electroless copper plating coating are achieved, but the complexity of surface treatment process increases
Solution Approach 1:
The invention specifies precise parameter ranges for particle area ratio (0.05 to 0.70) and average particle diameter (0.03 to 0.28 μm) that can be achieved through conventional surface treatment processes. By defining these target parameters, the invention enables manufacturers to optimize existing processes rather than requiring entirely new treatment methods, thus balancing performance improvement with process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the creation of substrates with optimal surface profiles that support both fine wiring formability and strong electroless copper plating adhesion, addressing the limitations of conventional technologies.
Implementation Method 1
the adhesion of the electroless copper plating coating is weak, and the reliability demanded for semiconductor package substrates or printed wiring boards is liable to be impaired
Data Source
AI summary
The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85.