Copper-Free Interconnect for Biocompatible Medical Devices
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Solution Overview
Problem
Existing medical devices for continuous monitoring of analyte concentrations in body fluids face challenges such as complex manufacturing processes, high production costs, and the need for biocompatible materials, particularly due to the use of copper in micro-vias which can be hazardous.
Innovation Solution
A medical device and manufacturing method that utilize a copper-free interconnect device with a conductive paste electrical contact, allowing for micro-via free double-sided contacting of conductive layers, thereby simplifying manufacturing and reducing costs while ensuring biocompatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper is used in micro-vias for interconnect devices, then electrical conductivity and reliability are improved, but biocompatibility deteriorates due to potential hazards
Solution Approach 1:
The patent extracts and removes copper from the interconnect device structure, replacing it with copper-free conductive materials such as conductive polymers or metal alternatives like gold or platinum. This extraction eliminates the biocompatibility issue while maintaining electrical conductivity through alternative conductive pathways.
Solution Approach 2:
The patent changes the material parameter of the conductive layer from copper-based to copper-free materials. By substituting the chemical composition while maintaining the conductive function, the solution resolves the biocompatibility conflict without sacrificing electrical performance.
2Manufacturing precision
If complex manufacturing processes are used to ensure precision and reliability, then manufacturing precision is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: forming conductive layers on separate sides of the insulating substrate, applying electrical contacts to specific surfaces, and assembling components in defined sequences. This segmentation allows each stage to be optimized independently, maintaining precision while improving overall ease of manufacture.
Solution Approach 2:
The patent performs preliminary actions by pre-forming conductive layers on the insulating substrate before final assembly. The conductive paths are established in advance on both sides of the substrate, and electrical contacts are positioned beforehand, which simplifies the final assembly process while ensuring precise electrical connections.
3Reliability
If traditional micro-via processes are used for contacting conductive layers, then electrical connection reliability is improved, but productivity deteriorates due to time-consuming manufacturing
Solution Approach 1:
The patent extracts and eliminates the micro-via formation process from the manufacturing workflow. By using surface-level electrical contacts that directly contact conductive layers without requiring through-substrate vias, the method removes the time-consuming drilling, plating, and alignment steps while maintaining reliable electrical connections through direct surface contact.
Solution Approach 2:
Instead of creating holes through the substrate to connect conductive layers (traditional micro-via approach), the patent inverts the approach by bringing electrical contacts from the opposite side of the substrate to make direct contact with conductive paths. This reversal eliminates the need for complex via formation while achieving the same electrical connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and reliable manufacturing of medical devices with reduced production costs and time, while ensuring biocompatibility and safety by eliminating copper from the interconnect device.
Implementation Method 1
The electrical contact is electrically connected to the second conductive layer
Data Source
Figure 1~2
Figure 3A~3C
Figure 4A~4B
AI summary
A medical device (110) and a method for manufacturing a medical device (110) are disclosed. The medical device (110) comprises: • at least one first part (112), wherein the first part (112) comprises at least one interconnect device (142), wherein the interconnect device (142) comprises: at least one first conductive layer (146); at least one insulation layer (148); and at least one second conductive layer (150), wherein the second conductive layer (150) is separated from the first conductive layer (146) at least by the insulation layer (148); • at least one electrical contact (132), wherein the electrical contact (132) comprises at least one electrical contact material (168), wherein the electrical contact (132) is electrically connected to the second conductive layer (150), wherein the electrical contact (132) is contactable from one side (192) of the interconnect device (142) opposing the second conductive layer (150), wherein the electrical contact (132) is provided micro-via free; and • at least one second part (114), wherein the second part (114) comprises at least one electrical connector (130), wherein the second part (114) is configured to mate with the first part (112) and to establish an electrical connection between the electrical connector (130) of the second part (114) and the first conductive layer (146) and to establish an electrical connection between the electrical connector (130) and the second conductive layer (150) via the electrical contact (132).