Air-Stable Copper-Gold Alloy Nanoparticle Ink for Flexible Electronics
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Solution Overview
Problem
Current metal nanoparticle inks require high-temperature sintering, which is not suitable for flexible substrates like plastics and papers, limiting the manufacturing of flexible and wearable sensors.
Innovation Solution
Development of room-temperature sinterable copper-gold alloy nanoparticle inks that are air-stable and can be used with aerosol-jet, inkjet, and dispenser printers to create conductive patterns on paper substrates, enabling low-cost and scalable manufacturing of wearable electronics and sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature sintering is used to create conductive patterns, then electrical conductivity is improved, but substrate damage occurs and manufacturing cost increases
Solution Approach 1:
The patent changes the sintering temperature parameter from high temperature to room temperature by using copper-gold alloy nanoparticles with specific compositional ratios. This parameter change allows the ink to achieve adequate electrical conductivity without requiring high-temperature processing that would damage flexible substrates
Solution Approach 2:
The patent uses composite copper-gold alloy nanoparticles as the conductive material. The alloy composition combines copper's high conductivity with gold's stability and lower oxidation tendency, creating a material that achieves adequate conductivity at room temperature without requiring high-temperature sintering
2Reliability
If high-temperature sintering is used to create conductive patterns, then electrical conductivity is improved, but manufacturing cost and failure rate increase
Solution Approach 1:
The patent changes the processing temperature parameter to room temperature, eliminating the need for expensive high-temperature equipment and reducing energy consumption. This makes the manufacturing process more accessible and cost-effective while maintaining adequate conductivity through the alloy composition
3Ease of manufacture
If copper nanoparticle inks are used for conductivity, then cost is reduced, but air stability deteriorates due to oxidation
Solution Approach 1:
The patent creates a composite copper-gold alloy where gold atoms are distributed within the copper matrix. The gold component provides oxidation resistance and structural stability while the copper provides conductivity, achieving both low cost and air stability simultaneously
Solution Approach 2:
The patent applies local quality by having gold atoms strategically positioned within the copper nanoparticle structure. The gold provides localized protection against oxidation at critical sites while maintaining the overall copper-rich composition for conductivity and cost-effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper-gold alloy nanoparticle inks allow for the production of wearable electronics and sensors at ambient conditions, reducing manufacturing costs and failure rates while maintaining high stability and conductivity, suitable for applications in wearable health monitors and point-of-care diagnostics.
Implementation Method 1
room-temperature sinterable metal alloy nanoalloy inks
Implementation Method 2
Printed electronics have demonstrated the viability for low-cost manufacturing of ever-smaller integrated electronic devices, especially using conductive nanomaterials
Data Source
AI summary
A low temperature sinterable copper nanoparticle or nanowire, comprising gold, zinc, nickel, tin, or aluminum as an alloying metal, and a capping agent. The nanoparticles or nanowires may be deposited on porous or fibrous substrates, the capping agent desorbed, and sintered at low temperature to form conductive traces or sensing elements. The nanoparticles or nanowires may be deposited by aerosol jet, inkjet or dispenser printers, for example.