Copper-Graphene Heat Dissipation Sheet for Z-Direction Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing graphene-based heat dissipation sheets for flip mobile phones suffer from poor thermal conductivity in the z-direction and are prone to water damage, leading to potential malfunctions and corrosion due to inadequate sealing.
Innovation Solution
A heat dissipation sheet comprising a copper-graphene composite powder with specific microstructures fabricated using 3D printing, enhancing thermal conductivity in all directions and forming a Cassie state for improved hydrophobicity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If graphene is used for heat dissipation in flip mobile phones, then heat dissipation performance in x and y directions is improved, but thermal conductivity in z direction remains poor
Solution Approach 1:
The patent creates a composite structure by combining graphene powder with metal powder (such as aluminum or copper) to form a heat dissipation sheet. The metal components provide high thermal conductivity in the z-direction, while graphene maintains excellent thermal radiation properties in x and y directions. This composite approach resolves the contradiction by integrating materials with complementary thermal conduction characteristics.
Solution Approach 2:
The patent applies different materials to different directions: graphene provides superior thermal radiation in the plane (x-y directions), while metal particles embedded in the composite structure enhance thermal conduction perpendicular to the plane (z-direction). This directional differentiation of material properties solves the anisotropic thermal conductivity problem.
2Temperature
If the module is designed for flip mobile phones, then heat dissipation function is achieved, but waterproofing is insufficient leading to potential damage
Solution Approach 1:
The heat dissipation sheet is designed to perform multiple functions simultaneously: it provides thermal radiation for heat dissipation, conducts heat in the z-direction through metal components, and offers waterproofing protection. By integrating these diverse functions into a single component, the patent eliminates the need for separate waterproofing layers while maintaining heat dissipation effectiveness.
Solution Approach 2:
The patent employs a thin film structure that combines heat dissipation materials with waterproof coating or encapsulation. This thin film approach provides effective waterproofing without significantly increasing the overall thickness or compromising the heat dissipation performance of the underlying graphene-based structure.
3Temperature
If graphene is made thicker to improve heat dissipation, then heat soaking evenly-spreading performance is enhanced, but space in the module is exceeded
Solution Approach 1:
The patent uses a composite of graphene powder and metal powder in optimized proportions to achieve effective heat dissipation in a thin configuration. The metal components provide thermal conduction pathways that enhance heat spreading efficiency without requiring increased thickness, thus maintaining compatibility with space-constrained flip phone designs.
Solution Approach 2:
The patent optimizes the particle size distribution, concentration, and morphology of graphene and metal powder components to maximize heat dissipation efficiency per unit thickness. By adjusting these parameters, the heat dissipation sheet achieves superior thermal performance in an ultra-thin form factor suitable for flip mobile phones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheet provides enhanced heat dissipation and waterproofing, preventing water ingress and extending the service life of electronic devices by improving thermal spreading efficiency and hydrophobic performance.
Implementation Method 1
copper has good thermal conductivity in the z direction, the composite of copper powder and graphene can improve the heat soaking evenly-spreading efficiency in all directions
Implementation Method 2
make water droplets on the surface of the heat dissipation sheet to form the Cassie state, so that the hydrophobic performance of the heat dissipation sheet can be improved
Implementation Method 3
the heat evenly-spreading layer can not only increase the surface area to improve the heat dissipation efficiency of heat radiation
Data Source
AI summary
The present application provides a heat dissipation sheet, a fabrication method thereof, and an electronic device using the same. The heat dissipation sheet is schistose and comprises a first graphene powder, and the heat dissipation sheet further comprises: a copper-graphene composite powder, mixed in the first graphene powder, wherein the copper-graphene composite powder is composed of a graphene-copper powder and a graphene powder. The heat dissipation sheet, the fabrication method thereof, and the electronic device using the same provided by the present application have better thermal conductivity and hydrophobic performance.