Copper-Graphene Laminate PCB Integration via Protective Layer
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Solution Overview
Problem
Incorporating graphene into printed circuit boards (PCBs) is challenging due to its susceptibility to damage during lamination, drilling, and electroplating processes, leading to improper passivation and reduced conductivity.
Innovation Solution
A method involving a lamination stack with a core, alternating graphene and metal layers, a photoresist layer, and a protective layer, where the protective layer is applied to shield the graphene during drilling and electroplating, allowing for the removal of metallic plating without damaging the underlying graphene, using materials like palladium or copper for plating and polymethyl methacrylate or polydimethyloxyaniline as protective layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If graphene is incorporated into PCB during lamination, then passivation and conductivity are improved, but graphene is damaged or destroyed during drilling and electroplating
Solution Approach 1:
A protective layer is applied to the graphene-containing lamination stack before drilling and electroplating operations. This preliminary protective action prevents direct contact between the drilling/electroplating processes and the graphene, thereby preventing damage while allowing these necessary manufacturing steps to proceed.
Solution Approach 2:
The protective layer acts as an intermediary between the harmful drilling/electroplating processes and the sensitive graphene. This intermediary layer allows the manufacturing processes to occur while blocking the harmful effects from reaching the graphene, thus preserving graphene integrity throughout production.
2Strength
If protective layer is applied to shield graphene during electroplating, then graphene integrity is maintained, but additional process steps and materials are required
Solution Approach 1:
The protective layer is applied in advance before the electroplating process, allowing the electroplating to proceed without modifying the graphene. This preliminary protective measure simplifies the overall process by preventing damage rather than requiring complex post-processing repairs or validations.
Solution Approach 2:
The protective layer serves as a disposable sacrificial element that is applied temporarily during manufacturing, performs its protective function, and is then removed. This disposable approach is simpler and more cost-effective than designing complex reusable protective systems or complex post-processing procedures.
3Reliability
If metallic plating is applied to lamination stack, then conductivity is improved, but graphene is unintentionally removed or damaged
Solution Approach 1:
The protective layer serves as an intermediary barrier during electroplating, allowing metallic plating to be deposited onto the lamination stack for improved conductivity while preventing the plating process from removing or damaging the underlying graphene layer.
Solution Approach 2:
The protective layer is applied in advance to counteract the harmful effects of the electroplating process on the graphene. This preliminary anti-action prevents the unintentional removal of graphene that would otherwise occur during standard electroplating operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively integrates graphene as a passivation layer on copper within PCBs, preventing damage during processing and maintaining conductivity, thereby enhancing the integrity and performance of the PCBs by preventing oxidation and ensuring high-frequency conductivity.
Implementation Method 1
a protective layer, where the protective layer is applied to shield the graphene during drilling and electroplating
Implementation Method 2
the removal of the protective layer causes a removal of the metallic plating in contact with the protective layer
Implementation Method 3
removing the protective layer comprises applying heat at a predefined temperature to the lamination stack, wherein the temperature is based on the protective layer
Data Source
AI summary
Methods for integrating copper-graphene laminate (CGL) in a multilayer PCB fabrication process and the resulting lamination stacks are disclosed. The methods include providing a core and applying a first graphene layer to the surface of the core. The methods further include applying a metal layer to the first graphene layer and applying a second graphene layer to the metal layer. Further, the methods include applying a photoresist layer to the second graphene layer and applying a protective layer to the photoresist layer. In some embodiments, the methods include applying a metallic plating to lamination stack. The methods further include drilling through the protective layer and at least one of a photoresist layer, the second graphene layer, the metal layer, the first graphene layer, and/or the core.