Copper Nanoplate Ink With Graphene Shielding for High-Temperature Conductors
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Solution Overview
Problem
Traditional metal conductors, particularly copper, are susceptible to oxidation and corrosion under extreme environments, limiting their reliability in advanced electronics requiring high temperatures and reactive atmospheres, and existing printable copper conductors lack the necessary stability and conductivity for next-generation flexible electronics.
Innovation Solution
The use of two-dimensional single-crystalline copper (111) nanoplates with surface coordinated formate ligands and in-situ copper-graphene conversion to create a hybridized conductor with enhanced oxidation and corrosion resistance, achieving stability up to 1300°C and low sheet resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper is used as a conductor material, then high electrical conductivity is achieved, but oxidation and corrosion resistance deteriorates under high temperatures and reactive atmospheres
Solution Approach 1:
A protective coating layer is applied to the copper conductor surface to act as an intermediary barrier between the copper and the reactive atmosphere. This coating prevents direct contact between oxygen/moisture and the copper surface, thereby eliminating oxidation and corrosion while preserving the underlying copper's high electrical conductivity.
Solution Approach 2:
The invention creates a composite conductor structure consisting of copper core material combined with a protective outer layer. This composite structure integrates the high conductivity of copper with the oxidation and corrosion resistance of the protective coating, achieving both improved reliability and environmental stability simultaneously.
2Temperature
If traditional metal conductors are used, then electrical conductivity is achieved, but thermal stability deteriorates at elevated temperatures exceeding copper melting point
Solution Approach 1:
The protective coating is designed to undergo parameter changes at elevated temperatures, specifically maintaining its protective function up to temperatures exceeding copper's melting point (1084°C). The coating material and structure are engineered to remain stable and intact under these extreme thermal conditions, preventing copper degradation.
Solution Approach 2:
The protective coating acts as a sacrificial or disposable layer that can be replaced or regenerated if damaged, while the underlying copper conductor remains intact. This approach allows the system to withstand extreme temperatures by sacrificing the outer protective layer rather than the valuable conductive material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybridized conductor exhibits high ampacity and stability at elevated temperatures, exceeding the melting point of bulk copper, suitable for high-temperature electronics with improved reliability and conductivity.
Implementation Method 1
surface coordinated formate ligands that inculcates high oxidation and corrosion resistance on a molecular level
Implementation Method 2
a rapid in-situ copper-graphene conversion led to a hybridized conductor, which displays stability at elevated temperatures up to 1300° C.
Implementation Method 3
high ampacity
Data Source
AI summary
Provided are conductive slurries with copper nanoplates. The copper nanoplates may be functionalized with formate groups and/or graphene or a graphene material. The slurries may be used as conductive inks, which may be used in 3D printing applications. Also provided are methods of making and using same.