Laser-Welded Copper Insert Cooler for Leak-Safe Power Modules
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Solution Overview
Problem
Existing coolers for power modules in automotive inverters face challenges in achieving stable coupling and reliable heat dissipation, often requiring additional components for secure connection and sealing, which can lead to reliability issues due to thermal cycling and potential coolant leakage.
Innovation Solution
A cooler unit for liquid cooling of power modules, comprising a copper insert with an upper and lower part, laser welded to an aluminum housing with internal flow channels, providing secure coupling and effective heat dissipation without the need for additional sealing elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If additional sealing components are used to ensure stable connection, then connection stability is improved, but device complexity and reliability under thermal cycling worsen
Solution Approach 1:
The patent merges the sealing function into the cooling channel structure itself by designing the cooling channel to extend to the housing surface, eliminating the need for separate sealing components. The cooling channel and housing form an integrated structure where the channel acts as both coolant passage and seal, reducing component count while maintaining connection stability under thermal cycling.
2Stability of the object's composition
If additional sealing components are used to ensure stable connection, then connection stability is improved, but reliability under thermal cycling and coolant leakage risk worsen
Solution Approach 1:
The sealing function is merged into the cooling channel structure, creating an integrated design where the cooling channel extends to and forms part of the housing surface. This eliminates interfaces between separate sealing components and the housing, reducing potential failure points from thermal cycling and improving reliability against coolant leakage.
3Temperature
If copper insert is laser welded to aluminum housing, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs a composite structure with a copper insert embedded in an aluminum housing, leveraging the high thermal conductivity of copper for heat dissipation while maintaining the lightweight and cost advantages of aluminum housing. The laser welding process joins the dissimilar metals (copper and aluminum) to create a functionally optimized composite component that achieves superior thermal performance.
Solution Approach 2:
The patent replaces traditional mechanical joining methods (such as screwing or riveting) with laser welding to attach the copper insert to the aluminum housing. Laser welding provides a more precise, automated, and reliable joint with better thermal contact, improving heat dissipation efficiency while the automation reduces manual manufacturing complexity.
4Temperature
If cooling channel extends to housing surface, then heat dissipation efficiency is improved, but structural strength may worsen
Solution Approach 1:
The housing is segmented into distinct functional zones: the cooling channel portion that extends to the surface for heat dissipation, and the remaining housing structure that maintains structural integrity. The copper insert is strategically positioned within the housing to provide thermal conduction pathways without compromising the overall structural strength of the aluminum housing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described cooler unit enables secure and reliable heat dissipation for power modules, particularly in high-voltage applications, by providing a stable connection and efficient thermal conductivity, while minimizing the risk of coolant leakage and thermal impact on adjacent components.
Implementation Method 1
The at least one insert comprises copper and is arranged inside the recess and laser welded to the housing such that during operation the coolant flows through the flow channel and around the lower part of the at least one insert
Implementation Method 2
The at least one insert is arranged inside the recess and laser welded to the housing
Implementation Method 3
during operation the coolant flows through the flow channel and around the lower part of the at least one insert
Data Source
AI summary
Cooler unit, semiconductor device and method for manufacturing a cooler unit. The cooler unit for liquid cooling of a power module comprises at least one insert that includes an upper part and a lower part and that is configured to be coupled to the power module with the upper part. The cooler unit further comprises a housing that limits a flow channel for a coolant and that comprises at least one recess which penetrates a wall of the housing up to the flow channel and which is configured in coordination with the at least one insert geometrically, wherein the at least one insert comprises copper and is arranged inside the recess and laser welded to the housing such that during operation the coolant flows through the flow channel and around the lower part of the at least one insert.