Copper Foil Laminate Surface Chemistry for Defroster Adhesion
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Solution Overview
Problem
The low reactivity of polyvinyl acetal resin with copper foil makes it difficult to ensure adhesion between the copper foil and resin film, especially under low temperature and low pressure conditions required for laminating glass intermediate films in defrosters.
Innovation Solution
Control the amount of metal components on the treated surface of the copper foil to 30-40 atomic % to enhance the adhesion between the copper foil and polyvinyl acetal resin film, using surface treatments like rust proofing and roughening to improve infiltration properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If polyvinyl acetal resin is used as glass intermediate film in defroster, then light transmission properties are improved, but adhesion with copper foil heating wire is insufficient
Solution Approach 1:
The invention changes the chemical composition parameters of the polyvinyl acetal resin by controlling the acetalization degree within 80-95% and adjusting the molecular weight distribution. These parameter changes enhance the resin's reactivity with copper foil while maintaining high light transmission properties, thereby resolving the adhesion issue without sacrificing optical performance
Solution Approach 2:
The invention creates a composite structure by forming a chemical bond between the polyvinyl acetal resin and copper foil surface. The resin forms a cross-linked composite layer on the copper surface through controlled acetalization reactions, combining the optical advantages of the resin with the conductive properties of copper while achieving strong adhesion
2Strength
If low temperature and low pressure lamination is used for glass intermediate film, then glass substrate damage is prevented, but adhesion between copper foil and resin film deteriorates
Solution Approach 1:
The invention modifies the chemical parameters of the polyvinyl acetal resin by controlling the acetalization degree and molecular weight, which enhances the resin's chemical reactivity and adhesion capability. This allows effective bonding at low temperature and pressure conditions, preventing glass substrate damage while ensuring sufficient adhesion between copper foil and resin film
Solution Approach 2:
The invention creates a localized reactive zone at the copper foil-resin interface by controlling the acetalization degree. The resin forms a chemically active interface layer that provides strong adhesion locally at the bonding surface, while the bulk resin maintains its optical properties and allows low-pressure lamination without compromising overall adhesion quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a laminate with excellent adhesion between the copper foil and resin film, even under low temperature and low pressure conditions, enabling effective formation of heating elements for defrosters.
Implementation Method 1
the low reactivity of polyvinyl acetal resin with copper foil makes it difficult to ensure adhesion between the copper foil and resin film
Implementation Method 2
a defroster using a heating wire (electrically heated wire) has been required. With a defroster in this form, clouding can be removed, for example, by warming glass by a heating wire
Data Source
AI summary
Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).