Copper-Clad Laminate Surface Composition for High-Frequency Adhesion

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Solution Overview

Problem

Conventional copper foils with low dielectric constant and low dielectric loss resins exhibit poor adhesion to copper foil, leading to weakened intermolecular forces and increased signal transmission distance, compromising high-frequency signal transmission in printed circuit boards.

Innovation Solution

A copper clad laminate with controlled zinc, nickel, and chromium contents at the copper foil surface, combined with a dielectric layer, enhances adhesion and signal integrity, suitable for high-frequency applications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If surface roughening treatment is applied to copper foil to enhance adhesion, then adhesion strength is improved, but signal transmission distance increases due to skin effect

Engineering Contradiction:

Improveadhesion strengthVSAvoidsignal transmission distance

Core Design Contradiction:

StrengthVSLength of moving object

Solution Approach 1:

The invention changes the chemical composition parameters of the copper foil surface by controlling zinc, nickel, and chromium content within specific ranges. This chemical parameter modification enhances adhesion strength through chemical bonding with the dielectric layer while maintaining a relatively smooth surface topology to minimize signal transmission distance increases.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite surface structure on the copper foil by incorporating multiple metal elements (zinc, nickel, chromium) in controlled proportions. This composite material approach provides both chemical reactivity for strong adhesion to the dielectric layer and maintains electrical conductivity for minimal signal loss.

Inventive Principle:

Principle #40Composite materials

2Loss of energy

If conventional low dielectric constant resin is used to reduce dielectric loss, then dielectric loss is reduced, but adhesion to copper foil deteriorates

Engineering Contradiction:

Improvedielectric lossVSAvoidadhesion strength

Core Design Contradiction:

Loss of energyVSStrength

Solution Approach 1:

The invention applies local quality modification by treating only the copper foil surface with specific metal element compositions, while the bulk copper foil and dielectric layer maintain their original properties. The modified surface layer provides chemical reactivity for adhesion without affecting the low dielectric loss properties of the bulk materials.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The invention changes the surface composition parameters of the copper foil to create optimal chemical bonding conditions with the dielectric resin, while maintaining the electrical and mechanical parameters of the bulk copper foil unchanged.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20250365860A1Copper-clad laminate and uses of the same

Publication Date: 2025.11.27 TAIWAN UNION TECHNOLOGY CORP

AI summary

A copper-clad laminate is provided. The copper-clad laminate comprises a dielectric layer; and at least one copper foil which has a first surface. The copper foil is disposed on at least one side of the dielectric layer, and is adhered to the dielectric layer with the first surface. The copper foil has a zinc content ranging from 40 μg/dm2 to 450 μg/dm2, a nickel content ranging from 10 μg/dm2 to 30 μg/dm2, and a chromium content of no more than 1 μg/dm2 at the first surface.