Copper Joining via Pre-coated Laser-Textured Surfaces
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Solution Overview
Problem
Existing copper joining processes often require high temperatures, which can lead to thermal degradation of insulating materials and components, and involve manual placement of joining materials, making them inefficient and potentially damaging.
Innovation Solution
A method involving surface treatment of copper components using a pulsed laser beam to create rough surfaces, followed by deposition of a continuous coating of a copper-based joining material via cold or thermal spray processes, allowing for low-temperature joining without manual placement of joining materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature joining processes are used to join copper components, then the joining strength is improved, but thermal degradation of insulating materials and components occurs
Solution Approach 1:
A joining material coating is applied to the copper component surfaces as an intermediary substance. This coating has a lower melting point than copper, allowing it to melt and form bonds at temperatures below copper's melting point (1085°C), thus achieving strong joints without exposing heat-sensitive insulating materials to damaging high temperatures
Solution Approach 2:
The joining process changes the temperature parameter from high temperature (required for direct copper bonding) to low temperature (sufficient for joining material bonding). The joining material's lower melting point enables bonding at temperatures that do not degrade surrounding insulating materials, resolving the contradiction between achieving strong joints and avoiding thermal damage
2Ease of manufacture
If manual placement of joining materials is used, then the joining process can be performed, but the process efficiency deteriorates and complexity increases
Solution Approach 1:
The joining material is pre-applied to the copper component surfaces in the form of a continuous coating before the joining operation. This preliminary action eliminates the need for manual placement of joining materials during the joining process, significantly improving efficiency and enabling automated manufacturing while maintaining process feasibility
Solution Approach 2:
The manual mechanical placement of joining materials is replaced by a automated coating application system. The continuous coating can be applied through processes such as electroplating, chemical deposition, or spray coating, replacing labor-intensive manual operations with automated mechanical or chemical processes that improve productivity
3Temperature
If a continuous coating of joining material is deposited on copper substrates, then the preexisting coating facilitates low-temperature joining, but the deposition process complexity increases
Solution Approach 1:
The deposition process utilizes electrochemical or chemical parameters to apply the joining material coating. By controlling electrochemical conditions (such as electrolyte composition, current density, and pH) or chemical reaction conditions, a uniform continuous coating is achieved without requiring complex equipment, thus reducing overall process complexity while enabling low-temperature joining
Solution Approach 2:
The deposition process is designed to be self-regulating or self-organizing, where the coating automatically forms uniform layers through electrochemical or chemical mechanisms. This self-service characteristic reduces the need for complex control systems and manual intervention, simplifying the deposition process while ensuring consistent coating quality for low-temperature joining
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, low-temperature joining of copper components without thermal degradation, reducing process complexity and cost by pre-existing coatings on the components, facilitating reliable electrical and mechanical connections.
Implementation Method 1
A surface treatment process is performed on the first surface of the substrate such that the first surface includes a plurality of peaks and valleys and exhibits a surface roughness (Rz) in the range of 10-100 μm
Implementation Method 2
the electrically conductive joining material may be deposited on the first surface of the substrate via a cold spray process or a thermal spray process
Implementation Method 3
the electrically conductive joining material may be deposited on the first surface of the substrate via a cold spray process or a thermal spray process
Implementation Method 4
During the joining process, the joining material melts and bonds to the metal components without melting the components themselves
Implementation Method 5
the joining material is allowed to solidify to form a solid joint between the metal components
Data Source
AI summary
Methods of manufacturing electrically conductive copper components for electric devices and method of joining electrically conductive copper components are provided. Each of the electrically conductive copper components are manufactured to include a preexisting coating of joining material located on or adjacent to a joining surface thereof.