Cu-Mg-P Alloy for Miniaturized Electrical Components
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Solution Overview
Problem
Cu—Mg-based alloys for electronic and electrical equipment face issues with insufficient conductivity, cold and bending workability, and castability due to high Mg content, which limits their application in high-conductivity and miniaturized components.
Innovation Solution
A copper alloy with 0.15-0.35 mass % Mg, 0.0005-0.01 mass % P, and a controlled number of Mg-P compounds to enhance conductivity, strength, and castability, while minimizing coarse compound formation for improved bending workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high Mg content is used in Cu-Mg-based alloy to improve strength, then strength increases, but conductivity becomes insufficient
Solution Approach 1:
The patent applies parameter changes by precisely controlling the Mg content within 0.03-0.5 mass% and P content within 0.003-0.05 mass%, rather than using high Mg content. This optimized parameter range achieves the desired strength while maintaining sufficient conductivity greater than 75% IACS, resolving the contradiction between strength improvement and conductivity maintenance.
2Strength
If high Mg content is used to improve strength, then strength increases, but cold workability and bending workability deteriorate due to coarse compound formation
Solution Approach 1:
The patent changes the parameter ranges by limiting Mg to 0.03-0.5 mass% and P to 0.003-0.05 mass%, which prevents the formation of coarse compounds that would deteriorate bending workability. This optimized composition achieves both adequate strength and excellent bending workability with 90 degrees or more in the bending workability evaluation.
Solution Approach 2:
The patent creates a composite material system by combining Cu with specific amounts of Mg and P elements. This composite approach allows the alloy to achieve both strength and good bending workability by controlling the interaction between these elements to form a fine-grained structure rather than coarse compounds.
3Strength
If high Mg content is used to improve strength, then strength increases, but castability degrades due to increased viscosity of molten copper alloy
Solution Approach 1:
The patent applies parameter changes by controlling Mg content to 0.03-0.5 mass% and P content to 0.003-0.05 mass%. This optimized parameter range reduces the viscosity increase in molten copper alloy compared to high Mg content alloys, thereby improving castability while still achieving the required strength through the controlled alloy composition.
4Weight of moving object
If miniaturization and reduction in thickness of component are implemented, then weight reduction is achieved, but severe bend working is required to ensure contact pressure
Solution Approach 1:
The patent changes the compositional parameters by optimizing Mg to 0.03-0.5 mass% and P to 0.003-0.05 mass%, which creates an alloy with excellent bending workability. This allows miniaturized and thinned components to undergo severe bend working to ensure adequate contact pressure while maintaining the weight reduction benefits of miniaturization.
Solution Approach 2:
The patent develops a composite copper alloy material with optimized Mg and P content that provides the necessary ductility and workability for severe bend working in miniaturized components. This composite material approach enables both weight reduction through miniaturization and adequate contact pressure through severe bending to be achieved simultaneously.
Data Source
AI summary
Provided is a copper alloy for electronic and electrical equipment including: 0.15 mass % or greater and less than 0.35 mass % of Mg; 0.0005 mass % or greater and less than 0.01 mass % of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, and an average number of compounds containing Mg and P with a particle diameter of 0.1 μm or greater is 0.5 pieces/μm2 or less in observation using a scanning electron microscope.