Copper-Manganese Sputtering Targets With Refined Grain Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Copper manganese alloys formed using slow cooling techniques often result in large, non-uniform microstructures that are detrimental during further processing, leading to defects and cracking in sputtering targets.
Innovation Solution
A method involving a two-step forging process with heat treatment steps to increase the number of grains by a factor of at least 10 and reduce the billet height by 40-95%, followed by additional heat treatment to achieve a refined grain structure, facilitating uniform deformation and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If slow cooling techniques are used during casting, then impurity reduction and higher purity billets are achieved, but large microstructures are formed that are detrimental during further processing
Solution Approach 1:
The patent divides the processing into multiple stages: casting to achieve purity, followed by separate forging and heat treatment steps to refine microstructure. The forging process segments the large grains into smaller units, while heat treatment further refines the microstructure, thus resolving the contradiction between maintaining purity and achieving fine microstructure.
Solution Approach 2:
The patent performs preliminary casting to establish high purity, then subsequently applies forging and heat treatment to refine the microstructure. This preliminary action approach allows the purity to be established first, followed by microstructure refinement without compromising the achieved purity level.
2Ease of manufacture
If conventional casting and forging methods are used, then production is simpler, but defects and cracking occur during further processing
Solution Approach 1:
The patent segments the manufacturing process into distinct operations: casting, forging with specific reduction ratios, and heat treatment at controlled temperatures. This segmentation allows each step to be optimized independently, reducing defects while maintaining manufacturing feasibility.
Solution Approach 2:
The patent changes key process parameters including forging reduction ratio (40-95%), heat treatment temperatures (500-750°C), and holding times to achieve refined microstructure and eliminate defects. These parameter changes improve reliability while maintaining ease of manufacture through controlled processing.
3Manufacturing precision
If billet height is reduced by 40-95% through forging, then refined grain structure is achieved, but processing complexity increases
Solution Approach 1:
The patent combines forging and heat treatment into an integrated process sequence where forging reduces the billet height and creates grain structure, followed immediately by heat treatment to refine and stabilize the microstructure. This merging of operations achieves grain refinement while managing processing complexity through coordinated steps.
Solution Approach 2:
The patent uses specific parameter ranges (forging reduction 40-95%, heat treatment temperature 500-750°C, time 1-8 hours) to achieve grain refinement. By optimizing these parameters, the process achieves refined grain structure without excessive complexity, as the parameters are within conventional processing ranges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces copper manganese alloys with refined shape and microstructure, reducing cracking and defects during further processing, enabling uniform deformation and improved performance in sputtering applications.
Implementation Method 1
heating the copper manganese billet at a temperature from about 650° C. to about 750° C. for from about 1 hour to about 3 hours in a first heat treatment step
Implementation Method 2
heating the copper manganese billet at a temperature from about 500° C. to about 650° C. for from about 4 hours to about 8 hours in a second heat treatment step to form a copper alloy
Data Source
AI summary
A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650° C. to about 750° C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500° C. to about 650° C. to form a copper alloy.