Cu-Mg Alloy for Electronic Connectors with Low Young's Modulus
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Solution Overview
Problem
Copper alloys used in electronic device components, such as connectors and lead frames, face issues with high Young's modulus leading to plastic deformation and poor bending formability due to high contact pressure and the presence of coarse intermetallic compounds, which hinder the formation of complex shapes.
Innovation Solution
A Cu-Mg solid solution alloy supersaturated with Mg, with a specific Mg content range and controlled grain size, is developed to achieve low Young's modulus, high proof stress, and excellent bending formability, suppressing intermetallic compound precipitation and enhancing work hardening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a copper alloy with high strength and high Young's modulus is used, then strength is improved, but bending formability deteriorates due to plastic deformation
Solution Approach 1:
The invention changes the material parameters by controlling the grain size to 1-100 μm and specifying Mg content (3.3-6.9 at %) to achieve a balance between strength and formability. This parameter optimization allows the material to have sufficient strength while maintaining bending formability without plastic deformation
Solution Approach 2:
The invention uses a composite microstructure consisting of a Cu-Mg solid solution matrix with controlled grain size and specific intermetallic compound distribution. This composite structure provides both the strength from the precipitates and the formability from the solid solution matrix
2Reliability
If a copper alloy with high Young's modulus is used, then electrical conductivity is maintained, but contact pressure stability deteriorates leading to plastic deformation
Solution Approach 1:
The invention optimizes the Young's modulus by controlling grain size and Mg content, achieving a value that balances electrical conductivity and contact pressure stability. The specific grain size range (1-100 μm) and composition parameters create a material that maintains stable contact pressure while preserving adequate electrical conductivity
3Strength
If coarse intermetallic compounds are present in the alloy, then strength is improved through precipitation hardening, but bending formability deteriorates due to cracking
Solution Approach 1:
The invention applies local quality control by distributing intermetallic compounds uniformly throughout the matrix rather than allowing coarse precipitates. The grain size control (1-100 μm) ensures that intermetallic compounds are distributed at an appropriate scale, providing strength enhancement without creating stress concentration points that would cause cracking during bending
4Ease of manufacture
If Mg content is increased to achieve solid solution strengthening, then bending formability is improved, but electrical conductivity deteriorates
Solution Approach 1:
The invention optimizes the Mg content parameter within the range of 3.3-6.9 at % to achieve the desired balance. This controlled composition provides sufficient solid solution strengthening for good bending formability while limiting the negative impact on electrical conductivity through excessive alloying
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alloy effectively reduces the risk of plastic deformation, enhances bending formability, and allows for the formation of complex shapes in electronic device components, while maintaining high electrical conductivity and strength.
Implementation Method 1
a Cu-Mg solid solution alloy supersaturated with Mg produced by solutionizing a Cu-Mg alloy and performing rapid cooling thereon
Implementation Method 2
a Cu-Mg solid solution alloy supersaturated with Mg produced by solutionizing a Cu-Mg alloy and performing rapid cooling thereon
Data Source
AI summary
A copper alloy for electronic devices has a low Young's modulus, high proof stress, high electrical conductivity and excellent bending formability and is appropriate for a component for electronic devices including a terminal, a connector, a relay and a lead frame. Also a method of manufacturing a copper alloy utilizes a copper alloy plastic working material for electronic devices, and a component for electronic devices. The copper alloy includes Mg at 3.3 to 6.9 at %, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is X at %, an electrical conductivity σ (% IACS) is in a range of σ≤{1.7241/(−0.0347×X2+0.6569×X+1.7)}×100, and an average grain size is in a range of 1 μm-100 μm. In addition, an average grain size of a copper material after an intermediate heat treatment and before finishing working is in a range of 1 μm-100 μm.