Multilayer Copper Microcooler Fusion Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional microcoolers fabricated by micromachining have limited channel and fin widths, which restricts their thermal characteristics and efficiency in cooling electronic components.
Innovation Solution
A multilayer and multichannel copper microcooler structure is developed by forming fin arrays in a silicon substrate using microetching, electroplating copper to fill inter-fin gaps, and performing planarization, followed by fusion bonding to create a stacked structure with finer channels and increased surface area for improved thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional micromachining is used to fabricate microcoolers, then manufacturing simplicity is maintained, but channel and fin widths are limited which restricts thermal characteristics
Solution Approach 1:
The fabrication process is divided into distinct stages: forming fin arrays in silicon substrate, electroplating copper channels, planarization, and fusion bonding of multiple layers. This segmentation allows each stage to be optimized independently, achieving fine channel widths while maintaining overall process feasibility
Solution Approach 2:
The invention transitions from single-layer micromachining to multilayer fusion-bonded structures. By stacking multiple copper microcooler layers with fine channels, the system achieves superior thermal characteristics through increased surface area and enhanced heat dissipation pathways in the vertical dimension
2Reliability
If single-layer microcooler structures are used, then fabrication simplicity is maintained, but thermal capacity is limited
Solution Approach 1:
Multiple copper microcooler layers are fusion-bonded together to create a integrated multilayer structure. This merging combines the thermal management capabilities of individual layers, achieving enhanced thermal capacity and redundancy that improves reliability of the overall cooling system
Solution Approach 2:
The invention uses composite construction combining silicon substrate structures with copper electroplated channels, followed by fusion bonding of multiple copper layers. This composite approach leverages the advantageous properties of each material and layer configuration to achieve superior thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multilayer copper microcooler structure enhances thermal capacity and thermal management of electronic components, improving their performance and preventing damage from excessive heat.
Implementation Method 1
electroplating copper to fill inter-fin gaps
Implementation Method 2
A surface of the second copper plate associated with the second copper microcooler structure can be bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond
Data Source
AI summary
Techniques that facilitate a copper microcooler structure are provided. In one example, a device includes a first copper microcooler structure and a second copper microcooler structure. The first copper microcooler structure includes a first copper plate and a first set of copper channels attached to the first copper plate. The second copper microcooler structure includes a second copper plate and a second set of copper channels attached to the second copper plate. A surface of the second copper plate associated with the second copper microcooler structure is bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond.