Copper-Molybdenum Composite Plate Bonding to Prevent Brazing Cracks

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Solution Overview

Problem

The existing heat radiation plates experience cracks between copper and copper-molybdenum layers due to heat during brazing, leading to an increased linear expansion coefficient.

Innovation Solution

A composite material with alternating copper layers and molybdenum powder compact impregnated with copper layers, bonded using a hot roll bonding method, maintains a low linear expansion coefficient and high thermal conductivity even after heat application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If copper layers and copper-molybdenum layers are alternately layered and bonded by brazing, then thermal conductivity is improved, but cracks occur between layers due to heat causing increased linear expansion coefficient

Engineering Contradiction:
Improvethermal conductivityVSAvoidbonding strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The invention changes the bonding method from brazing to hot roll bonding, altering the thermal and mechanical parameters of the bonding process. This avoids the high-temperature exposure that causes crack formation while maintaining effective thermal conduction through the layered structure.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses a composite structure of copper and copper-molybdenum layers where each material contributes its advantageous properties. Copper provides high thermal conductivity while molybdenum reinforces the structure, creating a composite that maintains both thermal performance and structural integrity under thermal stress.

Inventive Principle:
Principle #40Composite materials

2Strength

If high heat is applied during brazing, then bonding between layers is improved, but crack generation increases due to thermal expansion

Engineering Contradiction:
Improvebonding strengthVSAvoidcrack generation
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The invention replaces the thermal-bonding mechanism of brazing with a mechanical-bonding mechanism through hot roll bonding. This substitution reduces reliance on high-temperature thermal fields, thereby minimizing thermally-induced crack generation while achieving sufficient bonding strength through mechanical deformation and interdiffusion.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The bonding temperature and time parameters are optimized for hot roll bonding rather than brazing. The process uses controlled heating followed by mechanical rolling, changing the thermal-mechanical parameter profile to avoid the harmful effects of prolonged high-temperature exposure that cause crack formation.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composite material maintains a low linear expansion coefficient and high thermal conductivity, reducing the likelihood of cracks and enhancing thermal conductivity in the thickness direction.

Implementation Method 1

a layer of a molybdenum powder compact impregnated with copper; high thermal conductivity, reducing the likelihood of cracks and enhancing thermal conductivity in the thickness direction

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

bonded using a hot roll bonding method

Methodology Applied
Scientific EffectHot roll bonding:

Data Source

PatentUS12451407B2Composite material, semiconductor package, and method of manufacturing composite material
Publication Date: 2025.10.21 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US12451407B2 patent drawing
  • US12451407B2 patent drawing
  • US12451407B2 patent drawing

AI summary

A composite material has a plate shape and has a first surface and a second surface. The second surface is opposite to the first surface. The composite material includes a plurality of first layers and at least one second layer. The first layers and the second layer are alternately layered along a thickness direction of the composite material such that the first layers are located at the first surface and the second surface. Each of the first layers is a layer including copper. The second layer is a layer of a molybdenum powder compact impregnated with copper. A compressive residual stress of 50 MPa or less acts on each of the first layer located at the first surface and the first layer located at the second surface.