Copper-Molybdenum Heat Spreader Structure for Low Expansion

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Solution Overview

Problem

Existing heat dissipation substrates face challenges in achieving both a low linear expansion coefficient and high heat dissipation capacity.

Innovation Solution

A composite material with alternating layers of copper and molybdenum plates, where molybdenum plates have openings filled with copper, is designed to balance thermal conductivity and linear expansion by controlling the thickness and diameter ratio of the openings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat dissipation substrate uses copper for high thermal conductivity, then heat dissipation capacity is improved, but linear expansion coefficient increases

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidlinear expansion coefficient
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent uses a composite structure consisting of alternating copper layers and molybdenum plate layers. The copper layers provide high thermal conductivity for heat dissipation, while the molybdenum layers with embedded copper fillers provide low linear expansion coefficient. This composite material approach resolves the contradiction by combining materials with complementary properties in a layered configuration.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by creating regions with different material compositions within the heat dissipation substrate. The copper-rich first layers provide thermal conductivity in specific regions, while the molybdenum plate layers with copper fillers provide dimensional stability in other regions. This spatial differentiation of material properties allows simultaneous achievement of heat dissipation and low expansion.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If molybdenum plate thickness is increased to reduce linear expansion, then structural stability is improved, but thermal conductivity decreases

Engineering Contradiction:
Improvelinear expansion coefficientVSAvoidthermal conductivity
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The patent introduces a porous structure in the molybdenum plate by forming openings that are filled with copper material. This porous configuration allows the molybdenum plate to maintain its dimensional stability while the copper fillers within the openings contribute to thermal conductivity. The controlled porosity resolves the contradiction between structural stability and heat transfer capability.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The patent employs a nested structure where copper fillers are placed inside the openings of the molybdenum plate. This nested configuration allows the copper (with high thermal conductivity) to be embedded within the molybdenum matrix (with low expansion), enabling both materials to contribute their advantageous properties to the overall structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Temperature

If copper layer thickness is increased to improve thermal conductivity, then heat dissipation is improved, but linear expansion coefficient increases

Engineering Contradiction:
Improvethermal conductivityVSAvoidlinear expansion coefficient
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The patent optimizes the thickness parameters of both copper and molybdenum layers to achieve the desired balance between thermal conductivity and linear expansion coefficient. By carefully controlling the thickness of each layer within specific ranges, the patent ensures that the copper provides sufficient heat dissipation while the molybdenum layers adequately suppress overall expansion.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composite material achieves both a low linear expansion coefficient and high heat dissipation capacity, with thermal conductivity of 290 W/m·K or more and a linear expansion coefficient of 9.0 ppm/K or less for temperature changes up to 800°C.

Implementation Method 1

The first layers are formed from a metal material containing copper as a main component. The second layers include a molybdenum plate and a copper filler. thermal conductivity of 290 W/m·K or more

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The first layers and the second layers are stacked alternately in a thickness direction of the composite material. linear expansion coefficient of 9.0 ppm/K or less for temperature changes up to 800°C

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12525503B2Composite material, heat spreader and semiconductor package
Publication Date: 2026.01.13 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US12525503B2 patent drawing
  • US12525503B2 patent drawing
  • US12525503B2 patent drawing

AI summary

A composite material includes a plurality of first layers and a plurality of second layers. The total number of the first and second layers is 5 or more. The first and second layers are stacked alternately in the thickness direction of the composite material, such that the first layer is located at each of the first and second surfaces. The first layers are formed from a metal material containing copper as a main component. The second layer includes a molybdenum plate and a coper filler. The molybdenum plate has first and second faces that are each an end face in the thickness direction, and a plurality of openings extending through the molybdenum plate from the first face to the second face.