Copper Nanoparticle Conductive Compositions for Additive Manufacturing

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Solution Overview

Problem

Current copper nanoparticle compositions for additive manufacturing face challenges in achieving enhanced electrical conductivity, printability, and homogeneity, particularly in forming high aspect ratio structures and maintaining stability during the sintering process.

Innovation Solution

A conductive composition comprising at least 75% by weight of copper nanoparticles with an average size of no greater than 500 nm, combined with a polar solvent having a boiling point of at least 150°C and a dispersant, along with a polymer-bound copper, which enhances dispersability and reduces aggregation, enabling shear-thinning properties for improved printability and sinterability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If copper nanoparticle compositions are used for additive manufacturing, then electrical conductivity can be achieved, but printability and homogeneity are insufficient

Engineering Contradiction:

Improveelectrical conductivityVSAvoidprintability

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the particle size parameter to 5-60 nm and uses a polar solvent with boiling point ≥150°C to achieve both good printability and electrical conductivity. The specific parameter optimization resolves the contradiction between manufacturability and conductivity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite material system combining copper nanoparticles with polar solvent and dispersant, achieving synergistic effects where the composite provides both excellent printability and electrical conductivity, resolving the trade-off between these properties.

Inventive Principle:

Principle #40Composite materials

2Reliability

If copper nanoparticle compositions are used for additive manufacturing, then electrical conductivity can be achieved, but homogeneity and stability during sintering are insufficient

Engineering Contradiction:

Improveelectrical conductivityVSAvoidhomogeneity

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent introduces a dispersant as an intermediary substance that stabilizes copper nanoparticle aggregation during sintering and ensures homogeneous distribution. This mediator resolves the contradiction between achieving conductivity and maintaining compositional stability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

By optimizing particle size to 5-60 nm and selecting polar solvent with specific boiling point, the patent achieves homogeneous composition and stable sintering behavior while maintaining electrical conductivity, resolving the homogeneity-stability-conductivity triangle.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If larger copper nanoparticles are used, then electrical conductivity improves, but printability and aspect ratio formation deteriorate

Engineering Contradiction:

Improveelectrical conductivityVSAvoidaspect ratio formation

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent optimizes particle size to a specific range of 5-60 nm, which is smaller than conventional larger particles. This parameter change enables better aspect ratio formation and printability while achieving sufficient electrical conductivity through optimized composition and sintering.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite system where copper nanoparticles of optimized size are combined with polar solvent and dispersant, achieving a material that provides both good electrical conductivity and manufacturing precision for high aspect ratio structures.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves enhanced electrical conductivity, printability, and homogeneity, allowing for the formation of high aspect ratio structures with improved mechanical and electrical characteristics, and stable conductive traces through efficient extrusion and sintering processes.

Implementation Method 1

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 2

enabling shear-thinning properties for improved printability and sinterability

Methodology Applied

Scientific EffectShear-thinning: Shear Thinning

Data Source

PatentUS20250101237A1Conductive compositions for additive manufacturing, additive manufacturing methods, electrically conductive traces produced therefrom, and electronic articles

Publication Date: 2025.03.27 XTPL SA

AI summary

Conductive compositions for additive manufacturing, additive manufacturing methods, electrically conductive traces produced therefrom, and electronic articles are provided. The composition comprises at least 75 percent by weight of copper nanoparticles, at least 2 percent by weight of a polar solvent, and at least 0.1 percent by weight of a dispersant, all based on the total weight of the composition. The copper nanoparticles comprise an average particle size of no greater than 500 nm as measured with transmission electron microscopy. The polar solvent has a boiling point of at least 150° C.