Semiconductor Package Copper Pad-Sheet Interface for Reliable Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in achieving improved electrical characteristics and reliability, particularly in the connection between the chip structure and the substrate.
Innovation Solution
The semiconductor package includes a substrate with a chip structure, a connection pad, a connection sheet made of copper nanofibers, and a connection wire. The connection pad and sheet share the same material, with a grain boundary formed between them, enhancing electrical connectivity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection materials are used between the chip structure and substrate, then the manufacturing process is simple, but the electrical characteristics and reliability are insufficient
Solution Approach 1:
The connection sheet is constructed as a composite material comprising copper nanofibers embedded in a copper matrix. This composite structure provides both excellent electrical conductivity from the copper components and enhanced mechanical adhesion through the nanofiber network, resolving the contradiction between electrical performance and connection reliability without requiring complex multi-material assemblies
Solution Approach 2:
The invention changes the physical and microstructural parameters of the connection materials by introducing nanoscale copper fibers with specific diameter ranges (10-100 nm) and controlling their distribution within the copper matrix. These parameter changes at the nanoscale level significantly enhance electrical conductivity and adhesion strength while maintaining a relatively simple overall connection structure
2Reliability
If the connection pad and connection sheet use different materials, then material selection flexibility is high, but electrical characteristics deteriorate due to interface resistance
Solution Approach 1:
Both the connection pad and connection sheet are made of copper-based materials, creating a homogeneous material system throughout the connection path. This eliminates galvanic corrosion and minimizes interface resistance between dissimilar materials, while the nanofiber-reinforced copper structure provides the necessary mechanical and electrical performance. The homogeneous copper-based system simplifies manufacturing by using compatible materials throughout
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the adhesion and electrical connectivity between the connection wire, pad, and substrate, leading to enhanced reliability and performance of the semiconductor package.
Implementation Method 1
the connection pad and the connection sheet may include the same material, and a grain boundary may be formed between the connection sheet and the connection pad
Data Source
AI summary
A semiconductor package may include a substrate, a chip structure on the substrate, a connection pad on the substrate, a connection sheet on the connection pad, and a connection wire electrically connecting the chip structure and the substrate, the connection pad and the connection sheet may include the same material, and a grain boundary may be formed between the connection sheet and the connection pad.