Copper Passivation via Thin Polymer Overcoat
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Solution Overview
Problem
Copper structures in electronic devices corrode over time when exposed to ambient environments, leading to leakage current and potential catastrophic shorting due to applied voltage stress.
Innovation Solution
A copper structure is coated with a copper corrosion inhibitor layer, such as benzotriazole (BTA), followed by a protective polymer layer less than 35 μm thick, deposited using methods like ink-jet, screen print, or slit print deposition to prevent corrosion and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick protection layer is used to prevent copper corrosion, then corrosion protection is improved, but manufacturing complexity and material usage increase
Solution Approach 1:
The patent specifies a protection layer thickness parameter of less than 35 μm, optimizing the balance between corrosion protection and manufacturing simplicity. This parameter change resolves the contradiction by defining a sufficient thickness that provides adequate protection without requiring excessive material or complex manufacturing processes.
Solution Approach 2:
The patent uses a composite structure consisting of a copper corrosion inhibitor layer combined with a protection layer. This composite approach provides effective corrosion protection through the synergistic action of the inhibitor and protector, allowing for a thinner overall protection layer while maintaining reliability.
2Adaptability or versatility
If multiple deposition methods are available for the protection layer, then manufacturing flexibility is improved, but process selection complexity increases
Solution Approach 1:
The patent specifies that the protection layer can be deposited by ink jet deposition, screen print deposition, or slit print deposition. This multi-functionality allows the same protective function to be achieved through different deposition methods, providing manufacturing flexibility while maintaining a unified process framework.
3Ease of manufacture
If copper structures are left unprotected, then manufacturing simplicity is maintained, but leakage current and shorting risk increase over time
Solution Approach 1:
The patent applies a copper corrosion inhibitor layer and a protection layer to copper structures before they are exposed to the ambient environment. This preliminary protective action prevents corrosion and electrical instability from developing, ensuring long-term reliability while adding minimal complexity to the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer effectively prevents corrosion and damage to the copper corrosion inhibitor, enhancing the reliability of electronic devices by reducing or eliminating leakage current and ensuring the integrity of copper structures during handling and processing.
Implementation Method 1
a copper corrosion inhibitor layer coated with a protection layer
Implementation Method 2
a polymer deposited by ink jet deposition
Data Source
AI summary
In a described example, a method for passivating a copper structure includes: passivating a surface of the copper structure with a copper corrosion inhibitor layer; and depositing a protection overcoat layer with a thickness less than 35 μm on a surface of the copper corrosion inhibitor layer.