Plate-Shaped Copper Paste Particles for Dense Bonding Layers
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Solution Overview
Problem
Existing electrically conductive pastes containing copper particles, used in semiconductor devices and electrical components, often result in bonding layers with low denseness, insufficient bonding strength, and poor bonding reliability due to the spherical shape of the particles.
Innovation Solution
The use of oxide-containing copper particles with a specific light absorption characteristic, featuring an absorption peak in the range of 600 to 1000 nm, which are plate-shaped, allowing for a larger contact area and improved sintering properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spherical copper particles are used in paste composition, then the paste can be easily manufactured, but the bonding layer has low denseness and insufficient bonding strength
Solution Approach 1:
The patent applies the reverse of the spheroidality principle by deliberately avoiding spherical shapes. Instead of using conventional spherical copper particles, the invention employs plate-shaped copper particles with specific aspect ratios. This shape modification increases the contact area between particles during sintering, leading to higher denseness and bonding strength in the bonding layer, while still maintaining ease of manufacture through straightforward particle formation processes.
2Device complexity
If spherical copper particles are used in paste composition, then the paste formulation is simple, but the bonding layer has poor bonding reliability
Solution Approach 1:
The patent applies parameter changes by modifying the geometric parameters of copper particles - specifically the shape (from spherical to plate-shaped) and aspect ratio (controlled within 0.5 to 2.0). This parameter modification fundamentally changes the sintering behavior and bonding characteristics, resulting in improved bonding reliability. The paste formulation remains relatively simple, requiring only standard organic solvents and binders, while the particle parameter optimization delivers the reliability improvement.
3Strength
If plate-shaped copper particles with specific absorption characteristics are used, then bonding layer denseness and strength are improved, but particle characterization and quality control become more complex
Solution Approach 1:
The patent applies color changes as an optical indicator of particle shape and quality. Plate-shaped copper particles exhibit specific light absorption characteristics (absorption peak at 600-1000 nm) that differ from spherical particles. This optical property provides a simple, non-destructive method for quality control and particle characterization. The absorption spectrum serves as a fingerprint for verifying particle shape and ensuring consistent bonding performance, simplifying rather than complicating quality assessment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The oxide-containing copper particles enable the formation of bonding layers with high denseness, high bonding strength, and high bonding reliability, effectively addressing the limitations of spherical copper particles.
Implementation Method 1
an absorption spectrum of the oxide-containing copper particles dispersed in 1×106 times by mass of ethanol, as measured by a spectrophotometer, has an absorption peak in a range of wavelengths of from 600 to 1000 nm
Data Source
AI summary
Provided are an oxide-containing copper particle that can provide a paste composition capable of forming a bonding layer having high denseness, high bonding strength, and high bonding reliability, a paste composition including the same, and a semiconductor device, an electrical component, and an electronic component. In the oxide-containing copper particle of the present disclosure, an absorption spectrum of the oxide-containing copper particles dispersed in 1×106 times by mass of ethanol, as measured by a spectrophotometer, has an absorption peak in a range of wavelengths of from 600 to 1000 nm.