Copper Paste Resin Composition for Low Resistance Ambient Curing
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Solution Overview
Problem
Conductive copper pastes used in semiconductor devices face high specific resistance when cured under high temperature and short time conditions, limiting their effectiveness as bonding agents between semiconductor elements and substrates.
Innovation Solution
A resin composition comprising copper powder, a thermosetting resin, a fatty acid, an amine, and 4-aminosalicylic acid, which can be cured in an ambient atmosphere, maintaining a low specific resistance and appropriate viscosity, is developed. This composition includes specific components like oleic acid, triethanolamine, and phenolic resin, optimized for copper pastes to enhance conductivity and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive copper paste is used, then copper content can be increased to reduce cost, but specific resistance becomes high under high temperature and short time curing conditions
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by introducing a specific carboxylic acid component with controlled content (5-50 parts by mass per 100 parts copper powder), which modifies the curing characteristics and enables low specific resistance under high temperature short time curing conditions
Solution Approach 2:
The patent creates a composite resin system combining thermosetting resin, carboxylic acid, and copper powder in specific proportions, where the interaction between these components produces a paste that maintains low specific resistance after high temperature short time curing
2Quantity of substance
If copper is used as conductive filler instead of silver, then cost is reduced, but copper is susceptible to oxidation and requires ambient atmosphere curing
Solution Approach 1:
The patent creates a protective chemical environment through the carboxylic acid-resin-copper composite system that prevents oxidation of copper particles during high temperature short time curing in ambient atmosphere, eliminating the need for inert gas protection
Solution Approach 2:
The patent uses cost-effective copper powder as the conductive filler replacement for expensive silver, accepting the trade-off of oxidation susceptibility but compensating through the protective chemical environment provided by the resin system
3Productivity
If high temperature and short time curing is applied, then productivity is improved, but specific resistance of copper paste becomes high
Solution Approach 1:
The patent modifies the chemical composition of the paste by incorporating carboxylic acid in specific amounts, which changes the curing kinetics and enables achieving low specific resistance even under high temperature short time curing conditions that would otherwise increase resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables copper pastes to be cured in an ambient atmosphere with low specific resistance and appropriate viscosity, providing reliable bonding with reduced connection resistance between semiconductor elements and substrates, comparable to silver pastes.
Implementation Method 1
a resin composition containing: (A) a copper powder; (B) a thermosetting resin; (C) a fatty acid; (D) an amine; (E) 4-aminosalicylic acid; and (F) a solvent
Implementation Method 2
a resin composition which can be sintered under an ambient atmosphere
Data Source
AI summary
An object of the present invention is to provide a resin composition suitable for copper pastes, which can be cured in an ambient atmosphere and has a viscosity within an appropriate range and a low specific resistance after curing. This resin composition includes (A) a copper powder, (B) a thermosetting resin, (C) a fatty acid, (D) an amine, and (E) 4-aminosalicylic acid. Preferably, the (B) component is resol-type phenolic resin. More preferably, the (C) component is at least one selected from oleic acid, linoleic acid, linolenic acid, stearic acid, palmitic acid, lauric acid, butyric acid, and propionic acid.