Copper Pillar Solder Bump Structure for High-Force Bonding

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Solution Overview

Problem

The semiconductor industry faces challenges in increasing integration density and reducing minimum feature size, which complicates the manufacturing process and requires improvements in packaging and component integration.

Innovation Solution

A semiconductor structure is developed with a copper pillar within a solder bump, enhancing the strength of the conductive bump structure and enabling it to withstand large bonding forces with minimal deformation, thus preventing bridging between adjacent bumps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional solder bump structure is used, then the manufacturing process is simpler, but the strength and reliability under bonding force is insufficient

Engineering Contradiction:

Improvestrength of conductive bump structureVSAvoidcomplexity of conductive bump structure

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent applies nesting by placing a copper pillar inside a solder bump, creating a composite structure where one component is embedded within another. This nested configuration enhances the overall strength of the conductive bump structure while maintaining a compact form factor, directly addressing the technical contradiction between strength improvement and structural complexity.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent employs composite materials by combining copper and solder in a single conductive bump structure. The copper pillar provides high strength and electrical conductivity, while the surrounding solder material provides ductility and bonding capability. This composite approach resolves the contradiction by achieving superior mechanical strength without requiring multiple separate components, thus limiting the increase in device complexity.

Inventive Principle:

Principle #40Composite materials

2Productivity

If integration density is increased by reducing minimum feature size, then more components can be integrated, but the manufacturing process complexity increases

Engineering Contradiction:

Improveintegration densityVSAvoidcomplexity of manufacturing process

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the conductive bump structure into distinct functional components: a copper pillar for strength and conductivity, and a solder bump for bonding and electrical connection. This segmentation allows each component to be optimized independently for its specific function, enabling higher integration density through reduced feature sizes while managing manufacturing complexity through specialized process steps for each material layer.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS12334463B2Semiconductor structure having copper pillar within solder bump and manufacturing method thereof

Publication Date: 2025.06.17 NAN YA TECH

AI summary

The present application provides a semiconductor structure having a copper pillar within a solder bump, and a manufacturing method of the semiconductor structure. The semiconductor structure includes a substrate having a pad disposed thereon and a passivation at least partially surrounding the pad; and a conductive bump structure disposed over the passivation and the pad, wherein the conductive bump structure includes a first bump portion disposed over the passivation and the pad, a conductive pillar disposed over the first bump portion, and a second bump portion disposed over and surrounding the conductive pillar.