Copper-Plated Composite Substrate for Lithium Battery Adhesion
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Solution Overview
Problem
There is a need for rechargeable lithium batteries with higher energy density and capacity, and existing composite substrates for lithium batteries lack sufficient stability and adhesive strength between layers.
Innovation Solution
A composite substrate is developed with a support layer plated uniformly with a copper-containing metal layer, formed through plasma treatment, electroless plating, and electrolytic plating processes to enhance adhesion and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a metal layer is formed on a support layer for lithium battery composite substrate, then the energy density and capacity of the battery are improved, but the adhesive strength and stability between layers are insufficient
Solution Approach 1:
The patent applies preliminary actions by performing plasma treatment on the support layer surface before metal layer formation, and by using electroless plating to create a copper-containing metal layer that serves as an adhesive promoter. These preliminary treatments ensure strong adhesion between the support layer and subsequent metal layers, preventing delamination while maintaining high energy density performance
Solution Approach 2:
The patent employs composite materials by creating a multi-layer structure consisting of a support layer, a copper-containing metal layer formed through electroless plating, and additional metal layers. This composite structure combines the benefits of different materials: the support layer provides mechanical strength, while the copper-containing metal layer provides both electrical conductivity and strong adhesion, achieving both high energy density and reliable layer bonding
2Stability of the object's composition
If a metal layer is plated on support layer, then the stability of composite substrate is improved, but the uniformity of plating coverage is insufficient
Solution Approach 1:
The patent applies parameter changes by controlling the pH value, temperature, and composition ratios in the electroless plating solution to achieve uniform copper-containing metal layer deposition. By optimizing these parameters, the patent ensures consistent plating coverage across the entire support layer surface, achieving both improved stability and manufacturing precision
Solution Approach 2:
The patent uses an intermediary approach by employing a copper-containing metal layer as a intermediate layer between the support layer and subsequent metal layers. This intermediate layer acts as a mediator that promotes uniform coverage and strong adhesion, ensuring both stability and uniformity in the composite substrate structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite substrate achieves improved adhesive force between the metal layer and support layer, enhancing the stability and performance of rechargeable lithium batteries.
Implementation Method 1
performing a plasma treatment on at least a portion of a surface of a support layer
Implementation Method 2
impregnating the support layer with a first solution including a first copper ion to adsorb the first copper ion to the surface of the support layer
Implementation Method 3
impregnating the support layer with a second solution including a reductant to reduce the first copper ion
Implementation Method 4
impregnating the support layer and the first metal layer on the support layer with a third solution including a second copper ion
Data Source
AI summary
Disclosed are negative electrode composite substrates and fabrication methods thereof. The method of fabricating a negative electrode composite substrate includes performing a plasma treatment on at least a portion of a surface of a support layer, forming a first metal layer on the surface of the support layer, and forming a second metal layer on the first metal layer. Forming the first metal layer includes impregnating the support layer with a first solution including a first copper ion to adsorb the first copper ion to the surface of the support layer, and impregnating the support layer with a second solution including a reductant to reduce the first copper ion. Forming the second metal layer includes impregnating the support layer and the first metal layer on the support layer with a third solution including a second copper ion.


