Copper Plated Support Cavities for Thin Semiconductor Packages
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Solution Overview
Problem
Conventional semiconductor packages face issues with warping during production due to increased mounting rates of semiconductor chips, interference between chips and production devices, and difficulty in forming via connections due to increased chip thickness and reduced spacing, which limits the reduction of package thickness and resin volume.
Innovation Solution
The semiconductor package structure incorporates semiconductor chips embedded in cavity parts formed by copper plating, eliminating the need for a support plate and allowing for easier resin embedding and improved via connections, with cavity walls designed to avoid interference and facilitate thin package design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the mounting rate of semiconductor chips is increased to reduce package size, then the density of electronic parts is improved, but warping of the panel occurs during production and interference between chips and production devices happens
Solution Approach 1:
The support plate is divided into multiple regions with different thicknesses, creating localized support zones. Thinner regions allow chip placement while thicker regions provide structural stability and prevent panel warping during high-density mounting operations.
Solution Approach 2:
Different regions of the support plate have different thickness characteristics - regions under chip arrays are thinner to reduce interference with production devices, while peripheral and support regions are thicker to maintain panel stability and prevent warping during high-density mounting.
2Length of moving object
If the thickness of semiconductor chips is increased, then the chip structure is improved, but the distance between the support plate and wiring layers increases making via formation difficult
Solution Approach 1:
The support plate thickness is segmented into variable regions. In areas where thick chips are mounted, the support plate is made thinner to maintain a manageable distance for via formation, while other regions maintain adequate thickness for structural support.
Solution Approach 2:
The support plate exhibits local quality variations in thickness - thinner regions positioned beneath thick semiconductor chips to facilitate via formation and copper plating, while maintaining overall structural integrity through thicker regions in non-critical areas.
3Productivity
If the distance between adjacent semiconductor chips is reduced to increase density, then the package compactness is improved, but insulating resin cannot enter the space between chips
Solution Approach 1:
The support plate is pre-formed with variable thickness profiles before chip mounting. Thinner regions are created in advance in areas where chips will be densely packed, ensuring that insulating resin can access and fill the spaces between adjacent chips even at reduced spacing.
Solution Approach 2:
The support plate structure incorporates local thickness variations that create adequate spacing in critical regions, allowing insulating resin to penetrate between densely packed chips while maintaining overall high density and compact package dimensions.
4Ease of manufacture
If the thickness of encapsulation resin is increased to solve resin embedding issues, then resin embedding is improved, but the overall package thickness cannot be reduced
Solution Approach 1:
The support plate is segmented with thinner regions positioned where chips are mounted, creating natural spacing that facilitates resin embedding without requiring excessive resin thickness. This segmentation allows adequate resin penetration while keeping the overall package thickness minimal.
Solution Approach 2:
The variable thickness design of the support plate creates local conditions that promote resin embedding in critical areas between chips, eliminating the need to increase overall resin thickness and thereby maintaining thin package profile.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the volume of encapsulation resin, enables easier resin embedding regardless of chip thickness, and allows for a thinner package with enhanced EMI shielding and interlayer connections, suitable for various applications including mobile products.
Implementation Method 1
cavity parts of a support which is formed by copper plating and includes the cavity parts
Data Source
AI summary
An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide a thin semiconductor package with which a final product includes no support flat plate. To realize this, a semiconductor package having a structure wherein semiconductor chips are accommodated in cavity parts of a support which is formed by copper plating and includes the cavity parts is provided.