Copper Plating Bath Formulation for Uniform Thick Membranes
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Solution Overview
Problem
Existing copper plating technologies struggle to achieve uniform and smooth copper-plated membranes with a thickness of 20 μm or more, often resulting in surface roughness and poor luster due to limitations in the use of chloride and bromide compound ions in acidic copper plating solutions.
Innovation Solution
A copper plating solution composition is developed that includes specific proportions of chloride and bromide compound ions, within certain concentration ranges, to ensure uniform precipitation and a smooth surface finish, achieved by applying an electrical current to the substrate as the negative electrode in the presence of these ions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the copper-plated layer is increased to 20 μm or more, then the conductivity and structural integrity are improved, but the surface roughness increases and uniformity deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the plating solution by introducing a specific combination of chloride ions (0.01-1.0 g/L) and bromide ions (0.01-1.0 g/L) along with their organic compound counterparts. This parameter modification enables uniform copper deposition even at thicknesses of 20 μm or more, resolving the contradiction between achieving sufficient thickness for reliability and maintaining surface uniformity for manufacturing precision.
Solution Approach 2:
The patent employs a composite plating solution containing multiple types of additives including chloride compounds, bromide compounds, and their organic derivatives working together. This composite approach creates a synergistic effect that maintains deposition uniformity across thick copper layers, allowing both high thickness (20 μm+) and high surface quality to be achieved simultaneously.
2Quantity of substance
If conventional plating solutions are used to deposit thick copper layers (20 μm or more), then the required thickness is achieved, but the external appearance and luster deteriorate
Solution Approach 1:
The patent modifies the plating solution composition parameters by adding specific concentrations of chloride and bromide compounds along with organic additives. This parameter change transforms the deposition mechanism to produce uniform, high-luster surfaces even when depositing thick copper layers of 20 μm or more, simultaneously achieving quantity requirements and quality standards.
Solution Approach 2:
The chloride and bromide compounds act as intermediary substances that mediate between the copper ions and the substrate surface. These intermediaries facilitate uniform nucleation and growth of copper crystals throughout the thick layer, ensuring consistent external appearance and mirror-like luster across the entire 20 μm+ thickness while maintaining high copper deposition quantity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the deposition of copper membranes with excellent external appearance and even surface finish, even at thicker thicknesses, by optimizing the concentrations of chloride and bromide ions in the copper plating solution, resulting in copper-plated membranes with a mirror finish.
Implementation Method 1
electrical plating is generally performed having the object to be plated as one of the two electrodes and applying an electrical current between the electrodes within a plating bath
Implementation Method 2
applying an electrical current between the electrodes within a plating bath
Data Source
AI summary
To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.