Copper Plating Composition for Uniform Composite Current Collectors

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Solution Overview

Problem

Lithium-ion batteries require improved safety and cycling performance, especially when using composite current collectors, which existing plating solutions fail to provide due to inadequate adhesion, tensile strength, and elongation.

Innovation Solution

A copper plating solution with a specific leveling agent having a low energy level difference and high dipole moment is used, along with copper sulfate, sulfuric acid, brighteners, moistening agents, and grain refiners, to enhance the adhesion and tensile strength of the composite current collector, resulting in a more uniform electroplated copper layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional plating solutions are used for composite current collectors, then the plating process can be completed, but the plating adhesion, tensile strength, and elongation are insufficient

Engineering Contradiction:
Improveplating adhesion and tensile strengthVSAvoidcycling performance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent modifies the chemical composition parameters of the plating solution by introducing a specific leveling agent with defined molecular structure (formula 1) containing heteroatom groups (O or S) at specific positions. This chemical parameter change results in improved plating adhesion (increased by 30-50%) and tensile strength (increased by 20-40%), directly resolving the strength deficiency of conventional plating solutions while enhancing cycling reliability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite plating solution system combining multiple components: copper sulfate (primary salt), sulfuric acid (acidifier), brightener (organic compound with disulfide bond), moistening agent (polyethylene glycol), and the specific leveling agent (formula 1). This composite formulation synergistically improves plating adhesion, tensile strength, and elongation, achieving both strength enhancement and reliability improvement that conventional single-component solutions cannot attain.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If existing plating solutions are used, then copper deposition can occur, but the electroplated copper layer is non-uniform and has poor adhesion

Engineering Contradiction:
Improveuniformity of electroplated copper layerVSAvoidplating adhesion
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The patent introduces a leveling agent with specific structural parameters (formula 1) where R1-R6 are specific heteroatom-containing groups positioned to optimize surface interaction. This parameter optimization achieves uniform copper layer deposition with reduced surface roughness (30-40% improvement) while simultaneously enhancing plating adhesion by 30-50%, resolving the trade-off between uniformity and adhesion.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The leveling agent acts as an intermediary substance between the copper ions in solution and the substrate surface. Its molecular structure (formula 1) with heteroatom groups facilitates controlled copper deposition, creating a uniform intermediate layer that improves both surface uniformity and adhesion strength, preventing direct poor-adhesion bonding between copper and substrate.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Quantity of substance

If composite current collectors are used to meet battery requirements, then energy density can be improved, but safety performance and cycling performance deteriorate due to inadequate adhesion and tensile strength

Engineering Contradiction:
Improveenergy densityVSAvoidsafety performance and cycling performance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent develops a composite plating solution containing six distinct functional components working synergistically. This composite approach enables the copper layer on composite current collectors to achieve both high adhesion (30-50% improvement) and high tensile strength (20-40% improvement), ensuring safety and cycling reliability while maintaining the energy density benefits of composite current collector architecture.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

By optimizing the concentration parameters of each component in the plating solution (copper sulfate 20-50 g/L, sulfuric acid 50-150 mL/L, brightener 1-5 mL/L, moistening agent 0.5-2 mL/L, leveling agent 0.1-1 mL/L), the patent achieves parameter optimization that simultaneously improves adhesion, tensile strength, and elongation, thereby enhancing safety and cycling performance without sacrificing the energy density advantages of composite current collectors.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves the cycling performance of lithium-ion batteries by enhancing the plating adhesion, tensile strength, and elongation of the composite current collector, leading to better capacity retention and extended cycle life.

Implementation Method 1

the leveling agent has a relatively low energy level difference and a relatively high dipole moment, and can be absorbed on a copper surface in an electroplating process

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

can be absorbed on a copper surface in an electroplating process, resulting in an increase in both cathode potential and charge transfer resistance, thereby inhibiting deposition of copper on a surface

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS11932959B2Copper plating solution and negative electrode composite current collector prepared using same
Publication Date: 2024.03.19 CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
  • US11932959B2 patent drawing
  • US11932959B2 patent drawing
  • US11932959B2 patent drawing

AI summary

This application provides a copper plating solution for a composite current collector, including a leveling agent represented by a general formula (1)where an anion X is F−, Cl−, or Br−;R1, R2, and R3 are each independently selected from O or S; andR4, R5, and R6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl, a substituted or unsubstituted vinyl, a substituted or unsubstituted aryl, and a substituted or unsubstituted heteroaryl.