Copper Plating Leveler Composition for Concave Filling Flatness
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Solution Overview
Problem
Existing copper plating solutions struggle with insufficient filling of concave portions and dented plating films, making it difficult to achieve a flat surface on plated objects.
Innovation Solution
The use of a nitrogen-containing organic compound with a specific structure, represented by Chemical Formula 1, as an ammonium salt compound in the electrolytic copper plating process, enhances the formation of a plating film with excellent filling properties and high flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional levelers (nitrogen-containing organic compounds) are used in copper plating solutions, then selectivity of metal deposition is improved, but filling properties of concave portions deteriorate and plating film flatness deteriorates
Solution Approach 1:
The patent applies parameter changes by modifying the chemical structure of the leveler compound. Specifically, it introduces a sulfonate group (-SO3R) at the para position of the dimethylaminophenyl ring in the leveler molecule. This structural parameter change transforms the conventional nitrogen-containing organic compound into a new compound that simultaneously provides both selectivity and excellent filling properties, resolving the contradiction between these two requirements.
2Adaptability or versatility
If conventional levelers are used in plating solutions, then deposition selectivity on protrusions and depressions is improved, but plating film uniformity deteriorates due to dented surfaces
Solution Approach 1:
The patent modifies the molecular structure parameter of the leveler by adding a sulfonate group at the para position of the dimethylaminophenyl ring. This structural modification changes the compound's interaction properties with the plating surface, enabling it to simultaneously achieve deposition selectivity on protrusions and depressions while maintaining plating film uniformity and preventing surface dents.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ammonium salt compound improves the filling properties and flatness of concave portions in copper plating, ensuring a smooth and even plating film formation.
Implementation Method 1
additive for electrolytic copper plating, electrolytic copper plating solution composition and electrolytic copper plating method
Data Source
AI summary
An ammonium salt compound represented by the following Chemical Formula 1: