Electrolytic Copper Plating Solution Regeneration via UV-Ozone and Activated Carbon
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Solution Overview
Problem
The existing methods for regenerating electrolytic copper plating solutions fail to efficiently remove organic impurities, leading to decreased plating performance and the need for frequent replacement of solutions, as they only periodically use activated carbon to address the increasing concentrations of organic by-products and photoresist eluates.
Innovation Solution
A method involving ultraviolet-ozone treatment to decompose organic impurities in the electrolytic copper plating solution, followed by activated carbon treatment to remove these impurities, allowing for the regeneration of the solution without replacing it, thereby maintaining effective plating performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If only activated carbon treatment is used periodically to remove organic impurities, then the plating solution can be maintained for some time, but the organic impurity concentration increases over time and plating performance deteriorates
Solution Approach 1:
The impurity removal process is divided into two distinct stages: first, ultraviolet irradiation decomposes organic impurities into smaller molecules; second, activated carbon adsorbs and removes these decomposed impurities. This segmentation allows each treatment method to focus on its strength, achieving complete impurity removal and extending plating solution service life while maintaining consistent plating performance
Solution Approach 2:
The patent implements continuous circulation of the plating solution through the ultraviolet irradiation unit and activated carbon column, ensuring uninterrupted decomposition and removal of organic impurities. This continuous action prevents impurity accumulation and maintains stable plating performance over extended periods
2Reliability
If activated carbon is used to remove organic impurities, then some purification is achieved, but the removal efficiency is insufficient and impurity concentration continues to increase
Solution Approach 1:
Before the activated carbon treatment, ultraviolet irradiation is applied to pre-decompose large molecular weight organic impurities into smaller, more easily adsorbable molecules. This preliminary decomposition action enhances the subsequent activated carbon adsorption efficiency, enabling complete impurity removal and reducing plating solution replacement frequency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces organic impurity concentrations to levels that enable continuous use of the electrolytic copper plating solution, reducing the need for frequent solution replacements and lowering recycling costs by efficiently decomposing and removing impurities.
Implementation Method 1
an ultraviolet-ozone treatment device configured to oxidize the electrolytic copper plating solution to decompose an organic impurity in the electrolytic copper plating solution
Implementation Method 2
ultraviolet-ozone treatment of oxidizing the electrolytic copper plating solution to decompose an organic impurity
Implementation Method 3
an activated carbon treatment device configured to bring activated carbon into contact with the electrolytic copper plating solution which has been subjected to the ultraviolet-ozone treatment to remove the organic impurity
Data Source
AI summary
A method for regenerating an electrolytic copper plating solution containing a copper ion and at least one additive selected from the group consisting of a brightener, a carrier, and a leveler at least includes: ultraviolet-ozone treatment of oxidizing the electrolytic copper plating solution to decompose an organic impurity in the electrolytic copper plating solution; and activated carbon treatment of bringing activated carbon into contact with the electrolytic copper plating solution which has been subjected to the ultraviolet-ozone treatment to remove the organic impurity in the electrolytic copper plating solution.