Electrolytic Copper Plating Liquid via Fill Stability
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Solution Overview
Problem
Conventional electrolytic copper plating methods using sulfur-containing compounds face instability issues over time, leading to poor via fill performance and reduced thermal reliability, with formaldehyde posing environmental and health concerns, necessitating an alternative to enhance via fill ability without deteriorating the copper plate appearance.
Innovation Solution
The use of a sulfur-containing compound with an -X-S-Y- structure, specifically N, N'-bis(hydroxy methyl) urea, which reduces the formation of decomposed materials that cause plate deterioration and maintains good via fill ability, is introduced in the electrolytic copper plating liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electrolytic copper plating methods using sulfur-containing compounds are used, then via fill performance is improved, but plate appearance deteriorates and thermal reliability decreases over time
Solution Approach 1:
The patent changes the chemical parameters of the plating bath by introducing N,N'-bis(hydroxy methyl) urea as a new additive compound. This parameter change modifies the decomposition behavior of sulfur-containing compounds, preventing the formation of harmful decomposition products that cause plate appearance deterioration while maintaining effective sulfur content for via fill performance
Solution Approach 2:
N,N'-bis(hydroxy methyl) urea acts as an intermediary substance that mediates between sulfur-containing compounds and the copper plating process. It controls the decomposition of sulfur-containing compounds to produce beneficial effects (improved via fill) while preventing harmful effects (plate appearance deterioration and reliability loss)
2Manufacturing precision
If formaldehyde is used to improve via fill ability, then via fill performance is enhanced, but environmental and health problems arise and ignition safety is compromised
Solution Approach 1:
The patent replaces formaldehyde with N,N'-bis(hydroxy methyl) urea, which decomposes into harmless substances (ammonia, carbon dioxide, water) rather than persisting in the environment. This substitution eliminates the harmful effects of formaldehyde while maintaining the temporary chemical action needed for via fill improvement
Solution Approach 2:
The patent converts the potential harm of sulfur-containing compound decomposition into a benefit by using N,N'-bis(hydroxy methyl) urea to control the decomposition process. Instead of producing harmful substances that deteriorate plate appearance, the controlled decomposition produces beneficial effects for via fill while the urea itself decomposes harmlessly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrolytic copper plating method using the sulfur-containing compound and N, N'-bis(hydroxy methyl) urea ensures stable and effective via fill performance without compromising the plate appearance, maintaining high thermal reliability and avoiding the drawbacks of formaldehyde use.
Implementation Method 1
the electrolytic copper plating liquid that includes the compound that has an -X-S-Y- structure and the N, N'- bis (hydroxy methyl) urea
Implementation Method 2
electrolytic copper plating liquid and electrolytic copper plating method
Implementation Method 3
the speed of deposition of the plate film in the electrolytic copper plating is fast, 10 to 50 μm / hr
Data Source
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AI summary
Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of -X-S-Y-where X and Y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and the specific urea derivative N,N' - bis (hydroxyl methyl) urea. When the said copper electroplating liquid is used, deterioration of the appearance will not occur and a good filled via can be formed.