Copper PVD Chamber Shielding Against RF Noise Drift

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Solution Overview

Problem

Copper deposition during physical vapor deposition (PVD) is susceptible to redirection by radio frequency (RF) and electromagnetic (EM) noise, leading to non-uniform deposition and formation of gaps in back end of line (BEOL) and middle end of line (MEOL) conductive structures, which reduces conductivity and device lifetime.

Innovation Solution

Implementing a magnetic shield in the deposition chamber to insulate against RF and EM noise, ensuring uniform copper deposition and reducing the formation of air gaps in BEOL and MEOL structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If copper deposition is performed using physical vapor deposition (PVD), then copper can be deposited for electrical connection, but the deposition is susceptible to redirection by RF and EM noise leading to non-uniform deposition and formation of gaps

Engineering Contradiction:

Improveuniformity of copper depositionVSAvoidredirection by RF and EM noise

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

A magnetic shield is introduced as an intermediary component between the copper source and the substrate. The magnetic shield blocks RF and EM noise from reaching the copper atoms during deposition, preventing their redirection and ensuring uniform copper layer formation without gaps in the conductive structures

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent converts the harmful effect of RF and EM noise into a beneficial filtering process. By strategically placing magnetic shields in the deposition chamber, the previously problematic electromagnetic environment is transformed into a controlled setting where only beneficial copper deposition occurs, while harmful noise is selectively blocked

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If no magnetic shield is used, then the deposition chamber structure is simpler, but copper atoms are redirected by external noise causing gaps and reduced conductivity

Engineering Contradiction:

Improveconductivity of BEOL and MEOL structuresVSAvoidchamber structure with magnetic shield

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Magnetic shields are placed selectively in specific regions of the deposition chamber where RF and EM noise has the greatest impact on copper atom trajectories. This localized shielding approach ensures high conductivity in critical areas without unnecessarily complicating the entire chamber structure

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent modifies the electromagnetic parameter environment within the deposition chamber by introducing magnetic shielding materials. This changes the magnetic field characteristics and RF noise levels in the deposition region, creating optimal conditions for uniform copper deposition and reliable conductive structures

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The magnetic shield enhances the uniformity of copper deposition, improving conductivity and extending the lifetime of electronic devices by minimizing air gaps in BEOL and MEOL structures.

Implementation Method 1

a magnetic shield configured to reduce electromagnetic noise within the chamber

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

at least one electromagnet and at least one flow optimizer configured to direct copper ions from a copper target onto a wafer

Methodology Applied

Scientific EffectElectromagnetic force: Lorentz Force

Implementation Method 3

Copper deposition during physical vapor deposition (PVD)

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS20250329521A1Semiconductor tool for copper deposition

Publication Date: 2025.10.23 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A magnetic shield reduces external noise in a chamber including a target and at least one electromagnet for copper physical vapor deposition (PVD). The shield may have a thickness in a range from approximately 0.1 mm to approximately 10 mm to provide sufficient protection from radio frequency and other electromagnetic signals. As a result, copper atoms in the chamber undergo less re-direction from external noise. Additionally, even when hardware failure occurs during PVD (e.g., an electromagnet malfunctions, a wafer stage is not level, and/or a flow optimizer induces too much shift, among other examples), the copper atoms are less susceptible to small re-directions from external noise. As a result, back end of line (BEOL) and/or middle end of line (MEOL) conductive structures are formed in a more uniform manner, which increases conductivity and improves lifetime of an electronic device including the BEOL and/or MEOL conductive structures.