Copper Resin Bonding via Controlled Oxide Ratio
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional resin-metal bonded articles, such as those with copper components and polyphenylene sulfide (PPS) or polybutylene terephthalate (PBT) resins, face issues with adhesion strength, particularly when exposed to high temperatures or moisture, leading to peeling and compromised sealing properties.
Innovation Solution
A resin-metal bonded article is created by bonding a copper component with a surface containing a specific ratio of copper (I) oxide and copper (II) oxide, or with a triazine thiol derivative, to enhance adhesion. This is achieved through a process involving contact with an oxidant solution and insert molding, ensuring a copper oxide ratio of 10% to 75% on the copper surface, and optionally forming a triazine thiol coating to create additional chemical and anchor bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods (adhesive or insert molding) are used to bond copper component to resin component, then weight reduction is achieved by replacing metal members with resin members, but adhesion between copper component and resin component is greatly reduced when exposed to high temperature, high moisture environment or heat application
Solution Approach 1:
The copper bonding surface is pre-treated to form a specific ratio of copper (I) oxide to copper (II) oxide (1:4 to 4:1) before bonding with the resin. This preliminary oxidation treatment creates a surface composition that is specifically designed to enhance adhesion and maintain it under high temperature and moisture conditions, preventing the adhesion degradation that occurs with conventional bonding methods.
2Reliability
If triazine thiol coating is applied to maintain surface reactivity, then chemical bonding capability is improved, but adhesion strength is still insufficient and peeling occurs in harsh environments
Solution Approach 1:
The invention changes the critical parameter of copper oxide composition ratio on the bonding surface to a specific range (1:4 to 4:1 ratio of Cu2O to CuO). This parameter optimization creates the ideal chemical composition for strong adhesion to PPS or PBT resins, overcoming the insufficient adhesion strength and peeling issues that occur with conventional surface treatments like triazine thiol coating alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a robust bonding interface between the copper and resin components, preventing peeling and maintaining adhesion even in challenging environments, such as automotive applications, with enhanced durability and sealing performance.
Implementation Method 1
a copper bonding surface which contains copper (I) oxide and copper (II) oxide at a certain ratio
Implementation Method 2
there is a triazine thiol derivative in addition to copper (I) oxide and copper (II) oxide at a certain ratio as described above on the copper bonding surface side
Implementation Method 3
a method for bonding a copper component to a resin through insert molding or outsert molding according to which a melted resin is directly injected into a die where a copper component is placed
Data Source
AI summary
Disclosed is a resin-metal bonded article which is improved in adhesion between a copper component and a PPS or PBT resin. Also disclosed is a method for producing such a resin-metal bonded article. The resin-metal bonded article is obtained by bonding the resin component onto the surface of the copper component through a copper component bonding surface where there is copper oxide in the following range: 10%≦Cu2O/(Cu2O+CuO)≦75%. Preferably, this resin-metal bonded article further contains a triazine thiol derivative in the resin-component-side bonding surface of the copper component.