Copper-Compatible Resist Removal Composition

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Solution Overview

Problem

Conventional methods for removing copper-compatible resist patterns from copper lines in semiconductor and LCD devices often result in corrosion of the copper lines, reducing their reliability due to the galvanic effect and inadequate corrosion inhibition.

Innovation Solution

A composition comprising 0.1% to 10% by weight of an alkylbenzenesulfonic compound, 10% to 99% by weight of a glycolether solvent, and 0.5% to 5% by weight of a corrosion inhibitor, such as succinic acid or benzotriazole, is used to effectively remove the resist pattern without corroding the copper lines, minimizing the galvanic effect and ensuring the integrity of the copper lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional solvents are used to remove copper-compatible resist patterns, then the resist pattern can be removed, but the copper lines are corroded due to the galvanic effect

Engineering Contradiction:
Improveresist pattern removalVSAvoidcopper line integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces an intermediary substance (corrosion inhibitor) that mediates between the solvent and the copper line. The corrosion inhibitor forms a protective film on the copper surface, preventing direct contact and galvanic reaction between the solvent and copper, thus enabling resist removal without corrosion damage

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a composite removal solution by combining multiple components: solvent (for resist dissolution), corrosion inhibitor (for copper protection), and water (as a carrier). This composite formulation achieves both effective resist pattern removal and copper line protection simultaneously

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If conventional solvents are used to remove copper-compatible resist patterns, then the resist pattern can be removed, but surface corrosion occurs on the copper lines

Engineering Contradiction:
Improveresist pattern removalVSAvoidsurface corrosion
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary anti-action by pre-forming a protective film on the copper surface before the solvent acts on the resist. The corrosion inhibitor is applied first to create a protective barrier, preventing the subsequent solvent from causing surface corrosion during the resist removal process

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed composition ensures complete removal of the resist pattern without corroding the copper lines, thereby enhancing the reliability of copper lines and improving production yields by preventing galvanic effects and surface corrosion.

Implementation Method 1

a corrosion inhibitor, thereby completing the removal of the copper-compatible resist pattern without corrosion of the copper line

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

a composition for removing a copper-compatible resist pattern without corrosion of a copper line

Methodology Applied
Scientific EffectSolvation: Solvation

Data Source

PatentUS7671002B2Composition and method for removing copper-compatible resist
Publication Date: 2010.03.02 DONGJIN SEMICHEM CO LTD
  • US7671002B2 patent drawing
  • US7671002B2 patent drawing
  • US7671002B2 patent drawing

AI summary

A composition for removing a copper-compatible resist includes: about 0.1% to about 10% by weight of an alkylbenzenesulfonic compound; about 10% to about 99% by weight of a glycolether compound; and about 0.5% to about 5% by weight of a corrosion inhibitor.