Copper Ring Package Substrates for BGA Count and Warpage Reduction
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Solution Overview
Problem
Large die sizes and increasing IO counts in electronic packages lead to inefficiencies in power and ground delivery, resulting in non-critical to function (NCTF) and reserve-critical to function (RCTF) balls that occupy space and increase the package form factor, while also causing thermal issues due to die thinning.
Innovation Solution
Incorporating copper rings for power and ground delivery at the bottom of the package substrate underneath the die, replacing NCTF and RCTF balls, which reduces the XY form factor and improves power delivery by being closer to the die bumps, and acts as a stiffener to mitigate warpage during reflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If NCTF and RCTF balls are used to meet warpage requirements, then warpage control is improved, but package form factor increases and ball count increases
Solution Approach 1:
The patent extracts the warpage control function from the ball array and relocates it to copper rings positioned at the periphery of the package substrate. This separation allows the ball array to be optimized for electrical connections while the copper rings independently handle mechanical stability, eliminating the need for additional NCTF/RCTF balls and reducing package form factor.
Solution Approach 2:
The patent transitions from a two-dimensional ball array approach to a three-dimensional configuration by adding copper rings at the periphery of the substrate. This dimensional change enables warpage control through a different spatial arrangement, reducing the need for extended ball arrays and minimizing package footprint.
2Stability of the object's composition
If power balls are moved away from power bumps to accommodate NCTF/RCTF rows, then warpage requirements are met, but power delivery efficiency decreases
Solution Approach 1:
The patent extracts the power delivery function from the ball array and consolidates it onto copper rings that are positioned directly beneath the power bumps. This extraction allows power balls to be optimally located for electrical performance while copper rings provide the necessary mechanical support for warpage control.
Solution Approach 2:
The copper rings serve multiple functions simultaneously: they provide mechanical support for warpage control, enable efficient power delivery through direct positioning under power bumps, and reduce the overall ball count. This multi-functionality resolves the contradiction between warpage compliance and power delivery efficiency.
3Adaptability or versatility
If die size and IO count are increased, then functionality is improved, but package size increases and thermal issues worsen
Solution Approach 1:
The patent segments the package structure into distinct functional zones: copper rings at the periphery for mechanical support and power delivery, and optimized ball arrays in the center for signal connections. This segmentation allows independent optimization of each zone, enabling larger die sizes with improved thermal management through reduced package footprint and enhanced power delivery efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the number of power balls needed, minimizes the package form factor, enhances power delivery efficiency, and improves mechanical reliability and planarity by using conductive rings that function as part of the circuitry and stiffeners.
Implementation Method 1
acts as a stiffener to mitigate warpage during reflow
Implementation Method 2
ring comprises a conductive material
Data Source
AI summary
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die. In an embodiment, a package substrate is coupled to the die. In an embodiment, a ring is provided under the package substrate. In an embodiment, the ring comprises a conductive material. In an embodiment, the electronic package further comprises balls outside of the ring.