Antimicrobial Copper Sheet Overlay for Control Panels
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Solution Overview
Problem
The transmission of antibiotic-resistant microbes through hand-to-hand or hand-to-surface contact poses a significant health risk, particularly in environments like hospitals and nursing homes, leading to increased treatment costs and infection spread.
Innovation Solution
A control panel surface featuring an antimicrobial copper sheet overlay with deflection spots, which can be tempered to various hardness levels and printed with graphics, providing a durable and easy-to-clean surface that reduces microbial contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a control panel surface is made from standard materials, then it provides basic functionality, but it allows microbial transmission and requires frequent replacement
Solution Approach 1:
The patent applies composite materials by combining copper (providing antimicrobial properties) with polymer layers (providing structural integrity and switch functionality). The copper sheet serves as the base layer with embedded conductive traces, while polymer overlays provide protection and tactile feedback, creating a multi-functional composite structure that resists microbial transmission while maintaining manufacturability
Solution Approach 2:
The patent utilizes parameter changes by varying the thickness of copper layers (from 0.002 to 0.008 inches) and polymer coatings to optimize both antimicrobial effectiveness and mechanical properties. The copper thickness parameter is specifically adjusted to balance microbial resistance with flexibility and manufacturability, demonstrating parameter optimization to resolve the contradiction
2Strength
If the control panel surface is made durable and easy to clean, then it withstands frequent use and cleaning, but it may become harder to manufacture with precise deflection spots
Solution Approach 1:
The patent applies segmentation by dividing the control panel into distinct functional layers: copper base layer with conductive traces, polymer protective overlay, and embossed deflection spot regions. This segmentation allows each layer to be optimized independently - the copper provides durability and antimicrobial properties, while the polymer layer enables precise embossed deflection spots that are easier to manufacture with high precision
Solution Approach 2:
The patent uses preliminary action by pre-embossing the deflection spots into the copper or polymer layer before final assembly. This preliminary formation of raised or recessed areas at switch locations ensures precise alignment and tactile feedback while simplifying the overall manufacturing process, as the precision features are created in advance rather than requiring complex post-processing
3Ease of operation
If the copper sheet is made thin for flexibility, then it can be easily formed with deflection spots, but it may lack sufficient strength and durability
Solution Approach 1:
The patent applies composite materials by combining thin copper sheets (providing formability and antimicrobial properties) with supportive polymer layers (providing structural strength). The thin copper layer can be easily formed into complex shapes with deflection spots, while the polymer composite structure maintains overall durability and structural integrity, resolving the contradiction between formability and strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The antimicrobial copper sheet overlay effectively reduces microbial contamination, withstands frequent use and cleaning, and provides a durable surface for operating electronic devices, thereby minimizing the risk of infection transmission.
Implementation Method 1
Antimicrobial copper sheet overlays and related methods for making and using
Data Source
AI summary
Control panels with antimicrobial copper sheet overlays are disclosed. In some embodiments, the antimicrobial copper used in the copper sheet overlays can be selected from copper or copper alloys containing from about 60 to about 100 wt % copper. In other embodiments, the copper sheet overlays have one or more deflection spots to permit an operator to use the control panel to operate an electronic device. Some embodiments include methods to manufacture the control panels comprising antimicrobial copper sheet overlays. Further embodiments include methods for operating an electronic device using the control panels comprising antimicrobial copper sheet overlays.