Copper-Silver Electroplating via Methanesulfonate Complexes
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Solution Overview
Problem
Current copper-silver electroplating solutions face challenges such as toxic chemicals, AgCl precipitation, and limited industrial applicability due to high current density and miniaturization issues in microelectronics, leading to reliability concerns from electromigration in semiconductor wires.
Innovation Solution
A copper-silver dual-component metal electroplating solution using methanesulfonic acid and methanesulfonate with sulfur-containing thiourea compounds to form complexes with silver ions, avoiding AgCl precipitation and incorporating a surfactant for controlled deposition, applied with precise voltage and current control to achieve a stable plating layer with adjustable silver content.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional copper sulfate or cyanide plating solutions are used, then electroplating can be performed, but toxic chemicals are introduced and environmental protection is compromised
Solution Approach 1:
The patent changes the chemical parameters of the plating solution by using methanesulfonic acid and methanesulfonate instead of traditional copper sulfate or cyanide systems. This substitution maintains the electroplating functionality while eliminating the toxic characteristics of conventional plating chemicals, thereby resolving the contradiction between electroplating effectiveness and toxicity.
2Reliability
If silver nitrate is added to control silver content, then electromigration resistance is improved, but AgCl precipitation occurs affecting plating quality
Solution Approach 1:
The patent introduces methanesulfonate as an intermediary compound that complexes with silver ions in a controlled manner. This intermediary approach allows silver to be incorporated into the plating layer for electromigration resistance without causing uncontrolled AgCl precipitation, thereby maintaining both reliability and manufacturing precision.
Solution Approach 2:
The patent changes the chemical environment by using methanesulfonic acid system instead of traditional acidic systems. This parameter change controls the solubility and reactivity of silver compounds, preventing AgCl precipitation while still allowing controlled silver incorporation to achieve electromigration resistance.
3Length of moving object
If high current density is used for miniaturization, then wire size is reduced, but electromigration phenomenon increases causing reliability issues
Solution Approach 1:
The patent creates a composite copper-silver plating layer where silver is incorporated into the copper matrix. This composite structure provides both the miniaturization capability and enhanced electromigration resistance, as the silver particles distributed in the copper layer inhibit the electromigration phenomenon while allowing high current density operation in miniaturized wires.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a low-toxicity, environmentally friendly electroplating method that suppresses electromigration by achieving a copper-silver dual-component metal plating layer with controlled silver content, enhancing the reliability and applicability in semiconductor wire manufacturing.
Implementation Method 1
copper-silver dual-component metal electroplating solution and electroplating method
Implementation Method 2
applying an operating voltage to carry out electroplating on the substrate
Implementation Method 3
sulfur-containing double bond thiourea compound, which introduces a surfactant into the electroplating solution
Data Source
AI summary
A copper-silver dual-component metal electroplating solution includes copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chlorine ions, and water. An electroplating method for forming a copper-silver dual-component metal by using such an electroplating solution, the steps of which includes (a) contacting the copper-silver dual-component metal electroplating solution with a substrate; (b) applying an operating voltage, the current density of which is controlled to be between 0.1 and 2 ASD in order to carry out electroplating on the substrate. Therefore, the electroplating solution has environmental characteristics, such as less poisoning hazards, through the design of methanesulfonic acid and methanesulfonate electroplating solution. Also, the potential and the current are adjusted during the electroplating in order to obtain a copper-silver dual-component metal plating layer with a specific silver content.