Superfine Copper Alloy Wire Eutectic Phase Control
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Solution Overview
Problem
Existing superfine copper alloy wires struggle to achieve both high tensile strength of 800 MPa or more and high electric conductivity of 80% IACS or more, especially when the wire diameter is reduced to 0.008 to 0.05 mm, as previous methods fail to maintain both properties simultaneously.
Innovation Solution
A superfine copper alloy wire with a copper-silver eutectic crystal phase volume ratio of 3% to 20% and a silver to copper weight ratio of 1.0 to 3.5 wt %, combined with a manufacturing process involving metal casting, cold-working, and heat treatment, including rapid heating and quenching, to achieve the desired properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the wire diameter is reduced to 0.008 to 0.05 mm, then the conductor becomes thinner and more flexible, but the tensile strength decreases and the wire becomes easily broken
Solution Approach 1:
The patent applies parameter changes by precisely controlling the silver content (1.0 to 3.5 wt%) and the eutectic crystal phase volume ratio (3% to 20%) to achieve optimal balance between strength and conductivity in superfine wires. The heat treatment parameters (temperature of 300-550°C for 0.5-30 minutes) are also optimized to control the crystal structure and prevent excessive grain growth that would reduce strength
Solution Approach 2:
The patent creates a composite microstructure consisting of a copper matrix with dispersed silver eutectic crystal phases. This composite structure at the micro level provides both the ductility of copper and the strength enhancement from the eutectic phases, allowing the wire to maintain high tensile strength (800 MPa or more) even at superfine diameters (0.05 mm or less)
2Length of moving object
If the wire diameter is reduced to 0.008 to 0.05 mm, then the conductor becomes thinner, but the electric conductivity decreases due to increased resistance
Solution Approach 1:
The patent optimizes the silver content parameter (1.0 to 3.5 wt%) to achieve the right balance: enough silver to form beneficial eutectic phases that enhance conductivity, but not so much that it creates excessive resistance. The controlled eutectic phase volume (3% to 20%) ensures optimal electrical pathways while maintaining mechanical integrity at superfine dimensions
3Strength
If a Cu—Ag base alloy wire is used to achieve high strength and high electric conductivity, then the desired properties are obtained, but the amount of expensive silver increases
Solution Approach 1:
The patent precisely optimizes the silver content parameter to the range of 1.0 to 3.5 wt%, which is the minimum amount needed to form sufficient eutectic crystal phases (3% to 20% volume ratio) for achieving 800 MPa tensile strength. This minimized silver content reduces cost while maintaining the required high strength and conductivity properties
Solution Approach 2:
The patent replaces a significant portion of expensive silver with copper matrix, using the minimal necessary silver (1.0 to 3.5 wt%) solely for forming the strengthening eutectic phases. This substitution strategy reduces the quantity of expensive material while maintaining performance through the optimized composite microstructure
4Ease of manufacture
If existing manufacturing methods are used for superfine wires, then the production process is simplified, but both high tensile strength of 800 MPa or more and high electric conductivity of 80% IACS or more cannot be achieved simultaneously
Solution Approach 1:
The patent optimizes heat treatment parameters (temperature of 300-550°C for 0.5-30 minutes) to achieve the desired microstructure without excessive complexity. This controlled heating range prevents excessive grain growth that would reduce strength, while still relieving internal stresses from cold working, thereby achieving both high strength and high conductivity through parameter optimization rather than complex multi-step processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a superfine copper alloy wire with a tensile strength of 800 MPa or more and electric conductivity of 80% IACS or more, while reducing the amount of expensive silver required, and maintaining flexibility with an elongation of 1.1% or more, suitable for applications like medical probe cables and signal lines.
Implementation Method 1
cooling an uncoagulated copper alloy hot metal after the pouring at a cooling rate of 400° C./min or more to 500° C./min or less to form a casting
Implementation Method 2
cooling an uncoagulated copper alloy hot metal after the pouring at a cooling rate of 400° C./min or more to 500° C./min or less to form a casting
Implementation Method 3
recrystallizing a wiredrawn material obtained as a result of the cold working
Implementation Method 4
A superfine copper alloy wire with a copper-silver eutectic crystal phase volume ratio of 3% to 20% and a silver to copper weight ratio of 1.0 to 3.5 wt %, combined with a manufacturing process involving metal casting, cold-working, and heat treatment, including rapid heating and quenching
Data Source
AI summary
A superfine copper alloy wire has a copper-silver alloy wherein the superfine copper alloy wire has a final wire diameter of 0.05 mm or less, and the copper-silver alloy has a copper-silver eutectic crystal phase whose volume ratio to a whole volume of the superfine copper alloy wire is 3% or more and 20% or less.